Patent number: 12471424
Abstract: An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer. The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.
Type:
Grant
Filed:
August 31, 2021
Date of Patent:
November 11, 2025
Assignee:
BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Inventors:
Ke Wang, Zhanfeng Cao, Xinhong Lu, Qi Qi, Yan Qu, Zhiwei Liang, Yingwei Liu, Dapeng Xue, Guoqiang Wang, Jianguo Wang, Song Liu, Yongfei Li, Ting Zeng, Huan Liu, Wanru Dong, Heren Gui, Jian Yang, Haifeng Hu, Yu Jiang, Peng Xu, Weiwei Chu, Qi Gao
Publication number: 20230043951
Abstract: An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer . The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.
Type:
Application
Filed:
August 31, 2021
Publication date:
February 9, 2023
Inventors:
Ke WANG, Zhanfeng CAO, Xinhong LU, Qi QI, Yan QU, Zhiwei LIANG, Yingwei LIU, Dapeng XUE, Guoqiang WANG, Jianguo WANG, Song LIU, Yongfei LI, Ting ZENG, Huan LIU, Wanru DONG, Heren GUI, Jian YANG, Haifeng HU, Yu JIANG, Peng XU, Weiwei CHU, Qi GAO