Patents by Inventor Herko GENTH

Herko GENTH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR DEPOSITING THICK COPPER LAYERS ONTO SINTERED MATERIALS
    Publication number: 20160060781
    Abstract: The present invention relates to a method for electrodepositing a thick copper layer onto an electrically conductive, sintered layer. The thick copper layer has a high adhesion strength, is poor in defects and internal stress, and has high electrical and thermal conductivity. The thick copper layer on the sintered layer is suited for printed circuit boards for high power electronic applications.
    Type: Application
    Filed: May 9, 2014
    Publication date: March 3, 2016
    Inventors: Markus GLOEDEN, Herko GENTH, Nina DAMBROWSKY, Anthony MCNELLY, Robert RUETHER