Patents by Inventor Herman Carlo Floresca

Herman Carlo Floresca has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11508549
    Abstract: Beam intercept profiles are measured as a particle beam transversely scans across a probe. A current of beam particles, a detector intensity, or image pixel intensities can variously be measured to obtain the profiles. Multiple profiles are used to determine geometric parameters which in turn can be used to configure equipment. In one application, transverse beam intercept profiles are measured for different waist heights of the particle beam. Steepness of the several profiles can be used to determine a height of the probe as the height at which the profile is steepest. The known probe height enables placing the probe in contact with a substrate at another known height. In another application, transverse beam intercept profiles of orthogonal probe edges are used to position a beam waist, reduce spot size, or reduce astigmatism. Techniques are applicable to SEM, FIB, and nanoprobe systems. Methods and apparatus are disclosed, with variations.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: November 22, 2022
    Assignee: FEI Company
    Inventors: Herman Carlo Floresca, Brian Tilley
  • Patent number: 11328895
    Abstract: Apparatus and methods are disclosed for particle beam focusing, suitable for use in sample preparation or test environments, including SEM-based nanoprobing platforms. With a particle beam incident on a sample surface, stage current is used as an indicator of spot size. By scanning or searching settings of a working distance control, a control value having maximum (or minimum) stage current is used to set the beam waist at the sample surface. Alternatively, minima (or maxima) of reflected current can be used. Stigmator controls can be adjusted similarly to reduce astigmatism. The scan of control settings can be performed concurrently with sweeping the beam across a region of interest on the sample. Curved sweep patterns can be used. Energy measurements can be used as an alternative to current measurement. Applications to a nanoprobing workflow are disclosed.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: May 10, 2022
    Assignee: FEI Company
    Inventors: Herman Carlo Floresca, Brian Tilley
  • Publication number: 20220028647
    Abstract: Apparatus and methods are disclosed for particle beam focusing, suitable for use in sample preparation or test environments, including SEM-based nanoprobing platforms. With a particle beam incident on a sample surface, stage current is used as an indicator of spot size. By scanning or searching settings of a working distance control, a control value having maximum (or minimum) stage current is used to set the beam waist at the sample surface. Alternatively, minima (or maxima) of reflected current can be used. Stigmator controls can be adjusted similarly to reduce astigmatism. The scan of control settings can be performed concurrently with sweeping the beam across a region of interest on the sample. Curved sweep patterns can be used. Energy measurements can be used as an alternative to current measurement. Applications to a nanoprobing workflow are disclosed.
    Type: Application
    Filed: November 20, 2020
    Publication date: January 27, 2022
    Applicant: FEI Company
    Inventors: Herman Carlo Floresca, Brian Tilley
  • Publication number: 20210125808
    Abstract: Beam intercept profiles are measured as a particle beam transversely scans across a probe. A current of beam particles, a detector intensity, or image pixel intensities can variously be measured to obtain the profiles. Multiple profiles are used to determine geometric parameters which in turn can be used to configure equipment. In one application, transverse beam intercept profiles are measured for different waist heights of the particle beam. Steepness of the several profiles can be used to determine a height of the probe as the height at which the profile is steepest. The known probe height enables placing the probe in contact with a substrate at another known height. In another application, transverse beam intercept profiles of orthogonal probe edges are used to position a beam waist, reduce spot size, or reduce astigmatism. Techniques are applicable to SEM, FIB, and nanoprobe systems. Methods and apparatus are disclosed, with variations.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 29, 2021
    Applicant: FEI Company
    Inventors: Herman Carlo Floresca, Brian Tilley