Abstract: An apparatus for supporting and maneuvering a wafer comprises a handle having a gas inlet adapted to couple to a gas supply, a supporting surface coupled to the handle section including a frame structure having edge segments connecting at vertices and spoke elements extending from a center of the frame structure to the vertices, a gas supply channel coupled to the gas inlet that extends from the handle and branches into channels that run through the spoke elements, and a plurality of nozzles positioned at the vertices on the supporting surface and coupled to the channels in the spoke elements. Gas provided to the plurality of nozzles exits the nozzles in a stream directed parallel to the supporting surface and the stream of gas generates forces that enable wafers to be securely supported in a floating manner over the supporting surface without coming into direct contact with the supporting surface.

Abstract: A spin chuck according to the present invention is provided and is configured to eliminate the wrap of chemical over the wafer edge. The dual speed wafer spin chuck apparatus acts to prevent liquids from affecting the backside of a wafer during processing. An outer ring is placed around the wafer with a narrow gap between the two such that drops of liquid on the surface of the wafer will touch the outer ring as they move to the outermost edge of the wafer. By spinning this outer ring at high speed, centrifugal force causes these drops to be pulled off of the wafer and flung radially outward, thus preventing the liquid from affecting the backside of the wafer.

Abstract: The collection chamber apparatus acts to separate multiple fluids during the wafer processing cycle. Round, fluid collection trays surround the round wafer to collect each individual fluid, recycling them for later reuse. The trays move up and down by use of air cylinders and stack into each other to prevent cross contamination of the other fluids. Two opposing pistons (air cylinders) lift the trays in pairs to form fluid collection chambers. Each collection chamber has a unique drain which enters a separation manifold, flowing into separate tanks for later reuse.

Abstract: The collection chamber apparatus acts to separate multiple fluids during the wafer processing cycle. Round, fluid collection trays surround the round wafer to collect each individual fluid, recycling them for later reuse. The trays move up and down by use of air cylinders and stack into each other to prevent cross contamination of the other fluids. Two opposing pistons (air cylinders) lift the trays in pairs to form fluid collection chambers. Each collection chamber has a unique drain which enters a separation manifold, flowing into separate tanks for later reuse.

Abstract: A spin chuck according to the present invention is provided and is configured to eliminate the wrap of chemical over the wafer edge. The dual speed wafer spin chuck apparatus acts to prevent liquids from affecting the backside of a wafer during processing. An outer ring is placed around the wafer with a narrow gap between the two such that drops of liquid on the surface of the wafer will touch the outer ring as they move to the outermost edge of the wafer.

Abstract: An apparatus and method used to selectively etch materials from the edge and bevel areas of a silicon wafer are provided. In one configuration, a bevel etch spin chuck, for use in a device for removing unwanted material from an edge and bevel area of a wafer, includes a fluid channel, a separation barrier, and a gas channel that are substantially circular and concentric. A fluid, such as an etching solution, is provided to the fluid channel and contacts one or more areas at the edge and bevel area of the wafer. A stream of continuously flowing gas, such as nitrogen, is provided to the gas channel and purges an active side of the wafer.

Abstract: An apparatus and method for processing substrates such as silicon wafers, wherein process chemicals or other fluids are used on the top or other surface of the substrate followed by a de-ionized water (“DI”) or other fluid rinse. The used process chemicals or fluids are separated from the rinsing fluid with very little or no cross contamination between the two fluids. The apparatus consists of an annular collection chamber and spin chuck. During chemical processing, the fluids flow substantially horizontally on the top or other surface of a rotating wafer and are collected by the collection chamber on the periphery. Once chemical processing is complete, the collection chamber moves down to a closed position as shown in FIG. 2. DI water or other fluid may then be dispensed to rinse the wafer without mixing with the chemical or other processing fluid collected in the chamber.

Abstract: A method and apparatus to selectively etch layers of various materials from the edge and bevel areas of the active side of a silicon wafer, as well as from the inactive side of a wafer are disclosed. The width of the etched edge generally varies from about 0.5 to about 5 mm and however the etching may be determined by the geometry of the supporting chuck and the surface tension of the etching medium.

Abstract: The invention provides an apparatus and method for cleaning or etching wafers. The invention further provides a megasonic transducer designed to apply mechanical vibrations to a layer of fluid in contact with a wafer. The electromechanical transducer is housed in a quartz or sapphire lens which is chemically compatible with the layer of fluid, and sealed to protect the housing interior from fluids and chemical fumes. An electrical power source produces a signal that is sent to the transducer to generate a megasonic wave. The wave travels between the lens and the wafer, through the layer of fluid, dislodging small particles from the wafer which are then removed in the fluid stream. In one embodiment of the present invention, a wafer to be cleaned is placed on a rotatable support below a transducer assembly. A fluid is introduced through the transducer assembly to provide a layer of fluid between the lens and wafer.

Abstract: The invention provides an apparatus and method for cleaning or etching wafers. The invention further provides a megasonic transducer designed to apply mechanical vibrations to a layer of fluid in contact with a wafer. The electromechanical transducer is housed in a quartz or sapphire lens which is chemically compatible with the layer of fluid, and sealed to protect the housing interior from fluids and chemical fumes. An electrical power source produces a signal that is sent to the transducer to generate a megasonic wave. The wave travels between the lens and the wafer, through the layer of fluid, dislodging small particles from the wafer which are then removed in the fluid stream. In one embodiment of the present invention, a wafer to be cleaned is placed on a rotatable support below a transducer assembly. A fluid is introduced through the transducer assembly to provide a layer of fluid between the lens and wafer.

Abstract: A wafer scrubbing device for cleaning the surfaces of a thin disk disposed on a stationary spin chuck employs a double brush arrangement whereby brush rotation induces rotation of the disk to be cleaned and whereby the speed differential between the constant rotational speed of the brushes and the variable rotational speed of the disk due to the relative position of the brushes on the disk causes the scrubbing of both surfaces and the edge of the disk.

Abstract: A motor control system for driving a stepper motor and a typewriter or the like is provided, the control including reliable means for tracking incremental movements of the stepper and the element being driven by the stepper. Phase combinations of the stepper motor are energized as a function of tracked position, in a manner which optimizes movement from a present position to a target position. Present position is tracked by generating a pair of sensor signals and converting same to digital signals, which digital signals are constrained to change in accordance with the predetermined pattern on a step by step or increment by increment basis. If the pattern is not followed precisely the error is detected and a correction in position information can be made.

Abstract: A wafer scrubbing device for cleaning the surfaces of a thin disk disposed on a stationary spin chuck employs a double brush arrangement whereby brush rotation induces rotation of the disk to be cleaned and whereby the speed differential between the constant rotational speed of the brushes and the .[.variable.]. rotational speed of the disk due to the relative position of the brushes on the disk causes the scrubbing of both surfaces and the edge of the disk.