Patents by Inventor Herman Miller

Herman Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9801364
    Abstract: The knot-tying tool is a device that is used to assist in tying knots. The knot-tying tool is adapted for use with monofilament line. The knot-tying tool is further adapted for use with fishing hooks. The knot-tying tool includes a hook holder and a knotting post. The hook holder holds a fishing hook or a swivel such that a fishing line can be threaded through the fishing hook or swivel. The knotting post is a shaft around which the fishing line can be looped so as to assist in tying the knot attaching the fishing line to the fishing hook or swivel. The knot-tying tool includes a handle, a hook holder, a sleeve, and a knotting post.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: October 31, 2017
    Inventors: Herman Miller, Sandra Miller
  • Publication number: 20070119904
    Abstract: An electrical circuit apparatus that includes; a substrate having a top side, a ground layer, at least one thermal aperture, and at least one solder aperture; a heat sink; and an adhesive layer for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
    Type: Application
    Filed: January 30, 2007
    Publication date: May 31, 2007
    Applicant: MOTOROLA, INC.
    Inventors: John Waldvogel, Herman Miller
  • Publication number: 20070012751
    Abstract: An electrical circuit apparatus (300) that includes; a substrate (330) having a top side, a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate, the adhesive layer having at least one aperture (322) wherein aligning the at least one substrate solder aperture with the at least one adhesive layer aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
    Type: Application
    Filed: July 13, 2005
    Publication date: January 18, 2007
    Inventors: John Waldvogel, Herman Miller
  • Publication number: 20050121774
    Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the at least one substrate thermal aperture overlaps the heat sink, the adhesive layer having at least one thermal aperture (322) and at least one solder aperture (324), wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
    Type: Application
    Filed: January 7, 2005
    Publication date: June 9, 2005
    Inventors: John Waldvogel, Brian Bielick, Herman Miller, Billy Van Cannon
  • Publication number: 20050092814
    Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
    Type: Application
    Filed: December 1, 2004
    Publication date: May 5, 2005
    Inventors: John Waldvogel, Brian Bielick, Herman Miller, Billy Van Cannon
  • Patent number: 5368605
    Abstract: A tool for laparoscopic surgery comprising an elongated handle, an actuator connected to the handle between the opposite ends, a bore extending therethrough, a tool rod positioned in the bore, an actuator connected to the handle and engaging the tool rod for reciprocal motion within the bore. A sleeve extends over the tool rod and is secured to the handle. An instrument is secured to the tool rod at its distal end and is actuable by the sliding motion of the tool rod within the handle and sleeve. The handle has a cylindrical external surface and a grip remote from the distal end of the handle such that the handle can be held in the surgeon's hand like a writing instrument and the actuator be manipulated by the forefinger of the hand holding the tool to operate the instrument equally conveniently by right handed and left handed surgeons.
    Type: Grant
    Filed: March 9, 1993
    Date of Patent: November 29, 1994
    Inventor: Herman A. Miller, Jr.