Abstract: A heat-conductive honeycomb ceramic spacer having an array of apertures for facilitating assembly of a semiconductor device including a plurality of semiconductor stacks using a low-profile contact comprising a foil with raised portions corresponding to the locations of apertures in the ceramic spacer for forming contacts with the semiconductor stacks when the spacer and the stacks are sandwiched between the foil and another conductive sheet. Use of such a foil also allows disconnection of defective stacks in the device. Extra stacks are provided to compensate for defective stacks, according to an n-x design philosophy. Solder preforms may be included on the stacks and enhanced connections made to the foil of conductive sheet by causing reflux of the solder preforms. The invention may also be applied to multi-layer device constructions.

Abstract: A ceramic base component packaging assembly with high thermal transfer rates. The packaging assembly includes a molded plastic cover that receives spring washers, ceramic pads, resistive elements or other electronic components, and a thermally conductive ceramic base. The spring washers press the electronic elements against the ceramic base ensuring good thermal transfer. The ceramic base is an effective thermal conductor and electrical isolator for the device.

Abstract: A d.c. power supply system comprises a plurality of voltage regulating power supplies connected in a master slave configuration, the number of regulators being one greater than required to provide load current requirements. The master regulator generates a control signal to control the output of the individual slave regulators to provide balanced load sharing. Failure of one of the slave regulators is detected and the failed regulator replaced by the redundant regulator without interference to the output load current. Failure of the master regulator is detected by steering circuitry within each slave which senses an improper master error signal and transfers control to the reference error amplifier circuity of the slave regulators. Diagnosis of the error conditions is provided by logical analysis of output currents.