Patents by Inventor Herman TAN

Herman TAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11927202
    Abstract: A fan guard for a fan container includes a housing and a plurality of wings. The housing has a hollow interior defined by a cylindrical inner surface. The housing extends longitudinally between a first housing end and a second housing end. The plurality of wings is positioned within the hollow interior of the housing. Each wing of the plurality of wings extends radially, from a center of symmetry of the cylindrical inner surface to the cylindrical inner surface. Each wing of the plurality of wings is radially curved between the first housing end and the second housing end.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: March 12, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Herman Tan
  • Publication number: 20240057284
    Abstract: A system for cooling a heat-generating electronic component includes a first stage, a second stage, and a heat exchanger. The first stage has a first cooling path that circulates a first cooling fluid past the heat-generating electronic component to cause the first cooling fluid to absorb heat from the heat-generating electronic component and the temperature of the first cooling fluid to increase. The second stage circulates a second cooling fluid to increase a pressure of the second cooling fluid, remove heat from the second cooling fluid to decrease a temperature of the second cooling fluid, and decrease the pressure of the second cooling fluid to further decrease the temperature of the second cooling fluid. The heat exchanger is fluidly connected to the first stage and the second stage, and causes the second cooling fluid to flow past and absorb heat from the first cooling fluid.
    Type: Application
    Filed: November 15, 2022
    Publication date: February 15, 2024
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN, Tien-Juei CHUANG
  • Patent number: 11882672
    Abstract: A device for a computing system is disclosed. The device includes a body, a socket, and a connector. The body includes a panel and an internal conduit. The connector extends from the panel. The connector is removably coupled to the socket. The connector includes an outer end and an inner end. The connector also includes a nut that has an exterior surface mating with a corresponding interior surface of the socket, and a tubular inlet. The connector also has a sleeve with an internal bore and an external surface abutting the tubular inlet of the nut. The internal conduit is coupled to the inner end of the connector to circulate cooling liquid through the body. The nut includes an angled portion and the sleeve includes a flared portion for assisting in securing the nut and the sleeve in the internal conduit.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: January 23, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Herman Tan
  • Patent number: 11877424
    Abstract: A cold plate for cooling an electronic component is disclosed. The cold plate includes a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate. Also disclosed is a method for cooling the electronic component via the cold plate. The method includes allowing some fluid of the circulating cooling fluid to seep from the fluid channel into an internal chamber, and allowing vapor to be expelled through the vapor outlet.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: January 16, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Herman Tan, Tien-Juei Chuang
  • Patent number: 11874712
    Abstract: According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: January 16, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Herman Tan, Tien-Juei Chuang
  • Publication number: 20240008218
    Abstract: A hybrid cooling system is disclosed that combines a liquid coolant cycle and a refrigerant cycle to efficiently and effectively transfer heat away from a heat-generating component of a computing device. The liquid coolant cycle pumps a liquid coolant through a cold plate to extract heat from the heat-generating component. The heated liquid coolant passes through a coolant-to-refrigerant heat exchanger, where refrigerant from the refrigerant cycle absorbs the heat from the liquid coolant. The heated refrigerant passes through a compressor to a condenser, where the high-pressure, heated refrigerant is cooled by air passing over the condenser. The hybrid cooling system enables cooling of a heat-generating component better than by non-hybrid cooling systems.
    Type: Application
    Filed: September 2, 2022
    Publication date: January 4, 2024
    Inventors: Chao-Jung CHEN, Yu-Nien Huang, Herman Tan, Tien-Juei Chuang
  • Publication number: 20230397361
    Abstract: An air duct is disclosed. The air duct includes a housing for directing air over a plurality of slots within a computer system. The housing includes side housing walls and a top housing wall. The side housing walls are respectively connected to opposing ends of the top housing wall. The side housing walls extend in the same direction from the top housing wall. The air duct further includes a plurality of fins extending from the top housing wall in the same direction as the side housing walls. Each fin of the plurality of fins is arranged on the top housing wall so as to be positioned between adjacent slots of the plurality of slots when the housing is located within the computer system.
    Type: Application
    Filed: June 1, 2022
    Publication date: December 7, 2023
    Inventors: Chao-Jung CHEN, Herman TAN, Tien-Juei CHUANG, Chieh-Ling CHANG
  • Publication number: 20230345671
    Abstract: A boiling plate including a first surface and a second surface. The first surface provided for contacting a heated component. The second surface is opposite the first surface, and the second surface provided for contacting a liquid medium. The second surface has multiple cone-shaped cavities including a first cone-shaped cavity and a second cone-shaped cavity. A distance between an axis of the first cone-shape cavity and an axis of the second cone-shaped cavity of the multiple cone-shaped cavities are separated by a minimum spacing of four times a radius of the first cone-shaped cavity or the second cone-shaped cavity.
    Type: Application
    Filed: June 28, 2022
    Publication date: October 26, 2023
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN, Tien-Juei CHUANG
  • Publication number: 20230345672
    Abstract: A cold plate for cooling an electronic component is disclosed. The cold plate includes a base portion having a fluid channel with a fluid inlet and a fluid outlet, the fluid channel being configured to internally circulate a cooling fluid for carrying heat dissipated by the electrical component; and a cover coupled to the base portion such that the fluid channel is enclosed internally in the cold plate. The cover has a vapor outlet formed on a top side of the cover, the vapor outlet allowing generated vapor to exit from within the cold plate. Also disclosed is a method for cooling the electronic component via the cold plate. The method includes allowing some fluid of the circulating cooling fluid to seep from the fluid channel into an internal chamber, and allowing vapor to be expelled through the vapor outlet.
    Type: Application
    Filed: May 26, 2022
    Publication date: October 26, 2023
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN, Tien-Juei CHUANG
  • Publication number: 20230262934
    Abstract: A fluid cooling system includes a boiling plate, a compressor, and a condenser. The boiling plate contacts a heat-generating electronic component. The boiling plate receives a liquid such that the liquid absorbs heat from the electronic component and evaporates into a vapor. The compressor is fluidly connected the boiling plate and receives the vapor of the boiling plate. The compressor increases the pressure of the vapor such that the temperature of the vapor increases, and such that a saturation temperature of the vapor increases. The condenser is fluidly connected to the compressor and the boiling plate. The condenser receives the vapor from the compressor and removes heat from the vapor such that the vapor condenses back into the liquid. The boiling plate receives the liquid from the condenser. The system can include a pump that circulates the liquid and the vapor between the boiling plate, the compressor, and the condenser.
    Type: Application
    Filed: April 20, 2022
    Publication date: August 17, 2023
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN, Tien-Juei CHUANG
  • Publication number: 20230213987
    Abstract: According to certain aspects of the present disclosure, a system includes a heat-generating component and a thermal wake suppressor positioned downstream from the heat-generating component. The heat-generating component produces a thermal wake in a downstream direction. The thermal wake suppressor includes a spacing grid and a plurality of twist plates extending from the spacing grid at an angle. The spacing grid is defined by a plurality of longitudinal ribs and a plurality of transverse ribs that form a plurality of intersections. The plurality of twist plates is periodically arranged on the plurality of longitudinal ribs and the plurality of transverse ribs, such that a subset of the plurality of twist plates is arranged to break apart the thermal wake into sub-vortexes in the downstream direction.
    Type: Application
    Filed: January 5, 2022
    Publication date: July 6, 2023
    Inventors: Chao-Jung CHEN, Herman TAN, Tien-Juei CHUANG
  • Publication number: 20230071055
    Abstract: A nucleate boiling apparatus is disclosed that includes a base configured to fit onto a heat-producing object to provide immersion cooling to the object in a liquid-cooled computing environment. The apparatus further includes first and second pluralities of pipes extending from opposite sides of the base. Each of the first and second pluralities of pipes including a respective transition region and a respective flat region. The first and second pluralities of pipes in the transition regions extend away and up from the base, and the first and second pluralities of pipes in the flat regions extend away from the base in a fanned-out arrangement. The flat region of the second plurality of pipes is at a greater distance from the base than the flat region of the first plurality of pipes.
    Type: Application
    Filed: October 19, 2021
    Publication date: March 9, 2023
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN, Tien-Juei CHUANG
  • Patent number: 11419243
    Abstract: A system having a rack, an input manifold, an output manifold, and a drain manifold is installed. The rack is configured to support a computing device. The input manifold, the output manifold, and the drain manifold are each configured to be fluidly coupled to the housing. When the computing device is in a first position relative to the rack, the input manifold and the output manifold are fluidly coupled to the housing and the drain manifold is disconnected from the housing. When the computing device is in a second position relative to the rack, the input manifold and the output manifold are disconnected from the housing and the drain manifold is fluidly coupled to the housing. When the computing device is in a third position relative to the rack, the input manifold, the output manifold, and the drain manifold are disconnected from the housing.
    Type: Grant
    Filed: February 2, 2021
    Date of Patent: August 16, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Herman Tan
  • Patent number: 11395419
    Abstract: A system chassis insertable in a rack is disclosed. The system chassis includes a first end panel. The first end panel includes a first base surface, a first component slot, a first plurality of venting apertures, and a first protrusion. The first base surface has a first portion and a second portion. The first component slot is formed on the first portion of the first base surface. The first component slot is configured to receive a first system component. The first plurality of venting apertures is formed on the first portion of the first base surface and surrounding the first component slot. The first protrusion extends from the second portion of the first base surface. The first protrusion includes a second plurality of venting apertures and a second component slot. The second component slot configured to receive a second system component.
    Type: Grant
    Filed: January 26, 2021
    Date of Patent: July 19, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Herman Tan
  • Publication number: 20220159874
    Abstract: A device for a computing system is disclosed. The device includes a body, a socket, and a connector. The body includes a panel and an internal conduit. The connector extends from the panel. The connector is removably coupled to the socket. The connector includes an outer end and an inner end. The connector also includes a nut that has an exterior surface mating with a corresponding interior surface of the socket, and a tubular inlet. The connector also has a sleeve with an internal bore and an external surface abutting the tubular inlet of the nut. The internal conduit is coupled to the inner end of the connector to circulate cooling liquid through the body. The nut includes an angled portion and the sleeve includes a flared portion for assisting in securing the nut and the sleeve in the internal conduit.
    Type: Application
    Filed: March 17, 2021
    Publication date: May 19, 2022
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN
  • Publication number: 20220124919
    Abstract: A system chassis insertable in a rack is disclosed. The system chassis includes a first end panel. The first end panel includes a first base surface, a first component slot, a first plurality of venting apertures, and a first protrusion. The first base surface has a first portion and a second portion. The first component slot is formed on the first portion of the first base surface. The first component slot is configured to receive a first system component. The first plurality of venting apertures is formed on the first portion of the first base surface and surrounding the first component slot. The first protrusion extends from the second portion of the first base surface. The first protrusion includes a second plurality of venting apertures and a second component slot. The second component slot configured to receive a second system component.
    Type: Application
    Filed: January 26, 2021
    Publication date: April 21, 2022
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN
  • Publication number: 20220110222
    Abstract: A system having a rack, an input manifold, an output manifold, and a drain manifold is installed. The rack is configured to support a computing device. The input manifold, the output manifold, and the drain manifold are each configured to be fluidly coupled to the housing. When the computing device is in a first position relative to the rack, the input manifold and the output manifold are fluidly coupled to the housing and the drain manifold is disconnected from the housing. When the computing device is in a second position relative to the rack, the input manifold and the output manifold are disconnected from the housing and the drain manifold is fluidly coupled to the housing. When the computing device is in a third position relative to the rack, the input manifold, the output manifold, and the drain manifold are disconnected from the housing.
    Type: Application
    Filed: February 2, 2021
    Publication date: April 7, 2022
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN
  • Publication number: 20210324878
    Abstract: A fan guard for a fan container includes a housing and a plurality of wings. The housing has a hollow interior defined by a cylindrical inner surface. The housing extends longitudinally between a first housing end and a second housing end. The plurality of wings is positioned within the hollow interior of the housing. Each wing of the plurality of wings extends radially, from a center of symmetry of the cylindrical inner surface to the cylindrical inner surface. Each wing of the plurality of wings is radially curved between the first housing end and the second housing end.
    Type: Application
    Filed: August 5, 2020
    Publication date: October 21, 2021
    Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Herman TAN
  • Patent number: 11102909
    Abstract: An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: August 24, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Herman Tan, Yung-Hsiang Lu
  • Patent number: 10973149
    Abstract: A streamlined air baffle for efficiently directing air flow from a fan unit to a heat sink is disclosed. The streamlined air baffle has a top cover plate and a pair of side walls. The side walls are connected to the top cover plate. The top cover plate and one end of the side walls define an inlet. A curved surface of the top cover plate defines the outlet with the opposite ends of the side walls. The cross section area of the outlet is smaller than the cross section area of the inlet.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: April 6, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Herman Tan, Chih-Wei Lin