Abstract: A method and apparatus are provided for applying a bonding material such as solder paste or conductive epoxy to a printed circuit board or other substrate surface upon which one or more other electrical components may already have been premounted. An exemplary embodiment of the invention includes a removable fixture having a screening surface which is generally shaped to conform to the area targeted on the circuit board and which contains holes prepositioned to correspond to electrical contacts of the electrical component to be mounted. The screening surface is connected to a holding frame by at least two vertical sides to allow easy placement of the screening surface on a populated or empty circuit board and to protect other mounted electrical components from damage or displacement during the screening process.