Abstract: A support with solder ball elements for loading substrates with ball contacts is disclosed. One embodiment provides a system for loading substrates with ball contacts and a method for loading substrates with ball contacts. The support has a layer of adhesive applied on one side, the layer of adhesive losing its adhesive force to the greatest extent when irradiated. The support has solder ball elements, which are arranged closely packed in rows and columns on the layer of adhesive in a prescribed pitch for a semiconductor chip or a semiconductor component.

Abstract: An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor component further includes an upper interposing unit, on which upper external contact pads are arranged. The two interposing units are electrically connected to one another via bonding connections disposed at their edge areas. The basic semiconductor component is a compact component on which different, customer-specific semiconductor components can be stacked.

Abstract: The invention relates to a support (4) with solder ball elements (1) for loading substrates (2) with ball contacts. Furthermore, the invention relates to a system for loading substrates (2) with ball contacts and to a method for loading substrates (2) with ball contacts. For this purpose, the support (4) has a layer of adhesive (5) applied on one side, the layer of adhesive (5) losing its adhesive force to the greatest extent when irradiated. Furthermore, the support (4) has solder ball elements (1), which are arranged closely packed in rows (6) and columns (7) on the layer of adhesive (5) in a prescribed pitch (w) for a semiconductor chip or a semiconductor component.

Abstract: An electronic semiconductor module component with a semiconductor stack includes semiconductor components arranged in a vertically stacked relationship. A basic semiconductor component includes a lower interposing unit, on which lower external contact pads are arranged. The basic semiconductor component further includes an upper interposing unit, on which upper external contact pads are arranged. The two interposing units are electrically connected to one another via bonding connections disposed at their edge areas. The basic semiconductor component is a compact component on which different, customer-specific semiconductor components can be stacked.