Patents by Inventor Herman W. Chu

Herman W. Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230297147
    Abstract: Apparatuses, systems, and techniques to cool computing devices. In at least one embodiment, a system includes a heatsink including one or more connector pins to laterally couple the heatsink to one or more computing devices.
    Type: Application
    Filed: May 22, 2023
    Publication date: September 21, 2023
    Inventors: Michael L. Sabotta, Susheela N. Narasimhan, Reza Azizian, Herman W. Chu
  • Patent number: 11703921
    Abstract: Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: July 18, 2023
    Assignee: Nvidia Corporation
    Inventors: Michael L. Sabotta, Susheela N. Narasimhan, Reza Azizian, Herman W. Chu
  • Publication number: 20210278885
    Abstract: Apparatuses, systems, and techniques to cool computer processors. In at least one embodiment, a system comprises one or more processors and a heatsink connected by a flexible heat conduit to the one or more processors, and a position of the heatsink is adjustable.
    Type: Application
    Filed: March 9, 2020
    Publication date: September 9, 2021
    Inventors: Michael L. Sabotta, Susheela N. Narasimhan, Reza Azizian, Herman W. Chu
  • Patent number: 6643128
    Abstract: A method and system of controlling a cooling fan of a computer system including a power supply unit. The method includes sensing a power load of the power supply unit. A reference air temperature of the computer system is also sensed. Finally, a fan setting is determined based upon the sensed power load and the sensed reference air temperature. By basing the fan setting on both reference temperature and actual power supply load, the method and system effectively minimizes cooling fan operation, and thus resulting acoustic noise, when a computer system is operating at less than full capacity. In one preferred embodiment, a look-up table is provided in which a plurality of fan settings are included, each fan setting being based upon a correlation of power supply load and reference temperature. The method and system of the present invention is particularly useful with high-end, server-type computer systems being used for low-end applications, and is readily applied to multiple platforms.
    Type: Grant
    Filed: July 13, 2001
    Date of Patent: November 4, 2003
    Assignee: Hewlett-Packard Development Company, LP.
    Inventors: Herman W. Chu, Eugene Chung, Robert J. Thomas, Myron R. Tuttle, Samuel M. S. Lee
  • Publication number: 20030011984
    Abstract: A method and system of controlling a cooling fan of a computer system including a power supply unit. The method includes sensing a power load of the power supply unit. A reference air temperature of the computer system is also sensed. Finally, a fan setting is determined based upon the sensed power load and the sensed reference air temperature. By basing the fan setting on both reference temperature and actual power supply load, the method and system effectively minimizes cooling fan operation, and thus resulting acoustic noise, when a computer system is operating at less than full capacity. In one preferred embodiment, a look-up table is provided in which a plurality of fan settings are included, each fan setting being based upon a correlation of power supply load and reference temperature. The method and system of the present invention is particularly useful with high-end, server-type computer systems being used for low-end applications, and is readily applied to multiple platforms.
    Type: Application
    Filed: July 13, 2001
    Publication date: January 16, 2003
    Inventors: Herman W. Chu, Eugene Chung, Robert J. Thomas, Myron R. Tuttle, Samuel M.S. Lee
  • Patent number: 6352103
    Abstract: The invention consists of a modular apparatus for cooling an integrated circuit chip in a compact computer. The apparatus includes a heat collector assembly operatively connected to the chip, a heat exchange assembly and a heat pipe extending from the heat collector assembly to the heat exchange assembly. The heat exchange assembly includes a primary housing, a fan at one end of the housing, and a secondary housing at the opposite end of the primary housing. The secondary housing has a plurality of fins and the primary housing as a plenum chamber between the fins and the fan. The invention also comprises a high-performance notebook computer and cooling apparatus combination which includes a pivoted outer cover and a cooling system located along the pivoting axis of the outer cover.
    Type: Grant
    Filed: May 20, 1997
    Date of Patent: March 5, 2002
    Assignee: Intel Corporation
    Inventors: Herman W. Chu, Rakesh Bhatia