Patents by Inventor Hermann B. Sequeira
Hermann B. Sequeira has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10230163Abstract: A method including receiving a monopulse transmission by a monopulse antenna determining an angle of arrival of the monopulse transmission, using processing circuitry operably coupled to the monopulse antenna, determining, using the processing circuitry, an angle error for a high gain antenna based on the angle of arrival of the monopulse transmission, and causing the positioning of the high gain antenna based on the angle error.Type: GrantFiled: October 16, 2015Date of Patent: March 12, 2019Assignee: The Johns Hopkins UniversityInventors: Norman H. Adams, Hermann B. Sequeira, Matthew G. Bray, Dipak K. Srinivasan, Ron C. Schulze
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Publication number: 20160118715Abstract: A method including receiving a monopulse transmission by a monopulse antenna determining an angle of arrival of the monopulse transmission, using processing circuitry operably coupled to the monopulse antenna, determining, using the processing circuitry, an angle error for a high gain antenna based on the angle of arrival of the monopulse transmission, and causing the positioning of the high gain antenna based on the angle error.Type: ApplicationFiled: October 16, 2015Publication date: April 28, 2016Inventors: Norman H. Adams, Hermann B. Sequeira, Matthew G. Bray, Dipak K. Srinivasan, Ron C. Schulze
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Patent number: 4853613Abstract: A calibration procedure for vector network analyzers utilizing a known standard, an unknown standard and a pair of offsets bearing a known length ratio (2:1) between them whereby measurements taken on the standards and their combinations with the offsets result in self-verifying redundant equations which furnish: (1) error terms according to well-known flow graph models, (2) the reflection of the unknown standard, (3) the transmission factor of the waveguiding medium from which the offsets are realized regardless of the waveguide's loss or dispersion, and (4) a figure of merit (corruption coefficient) for the quality of the acquired raw data without the necessity for computing the error terms, connecting verification standards or otherwise completing the calibration process.Type: GrantFiled: October 27, 1987Date of Patent: August 1, 1989Assignee: Martin Marietta CorporationInventors: Hermann B. Sequeira, Michael W. Trippe, Rajendra S. Jakhete
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Patent number: 4843353Abstract: A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness d.sub.s and permittivity .epsilon..sub.s ; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity .epsilon..sub.g, where .epsilon..sub.g >.epsilon..sub.s, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness d.sub.1, and permittivity .epsilon..sub.1, where .epsilon..sub.g >.epsilon..sub.1, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide frequency band.Type: GrantFiled: November 27, 1985Date of Patent: June 27, 1989Assignee: Martin Marietta CorporationInventor: Hermann B. Sequeira
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Patent number: 4835500Abstract: A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness d.sub.s and permittivity .epsilon..sub.s ; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity .epsilon..sub.g, where .epsilon..sub.g >.epsilon..sub.s, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness d.sub.1, and permittivity .epsilon..sub.1, where .epsilon..sub.g >.epsilon..sub.l, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide frequency band.Type: GrantFiled: November 27, 1985Date of Patent: May 30, 1989Assignee: Martin Marietta CorporationInventor: Hermann B. Sequeira
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Patent number: 4835543Abstract: A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness d.sub.s and permittivity .epsilon..sub.s ; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity .epsilon..sub.g, where .epsilon..sub.g >.epsilon..sub.s, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness d.sub.1, and permittivity .epsilon..sub.1, where .epsilon..sub.g >.epsilon..sub.1, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide frequency band.Type: GrantFiled: November 27, 1985Date of Patent: May 30, 1989Assignee: Martin Marietta CorporationInventor: Hermann B. Sequeira
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Patent number: 4689584Abstract: A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness d.sub.s and permittivity .epsilon..sub.s ; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity .epsilon..sub.g, where .epsilon..sub.g >.epsilon..sub.s, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness d.sub.1, and permittivity .epsilon..sub.1, where .epsilon..sub.g >.epsilon..sub.1, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide band.Type: GrantFiled: November 27, 1985Date of Patent: August 25, 1987Assignee: Martin Marietta CorporationInventor: Hermann B. Sequeira
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Patent number: 4689585Abstract: A transmission line comprising a multi-layer dielectric slab structure including: a dielectric substrate layer (30) having a thickness d.sub.s and permittivity .epsilon..sub.s ; a conductive ground plane (31) on the bottom surface of the dielectric substrate layer (30); a dielectric guiding layer (32) having a thickness h and permittivity .epsilon..sub.g, where .epsilon..sub.g >.epsilon..sub.s, attached to the top surface of dielectric substrate layer (30); at least one elongated and relatively narrow dielectric loading strip layer (33) having a width W, thickness d.sub.1, and permittivity .epsilon..sub.1, where .epsilon..sub.g >.epsilon..sub.1, attached to the top surface of the dielectric guiding layer (32); and a conductive coating (34) on the top surface of the dielectric loading strip layer (32). Such a structure permits single mode propagation over a relatively wide band.Type: GrantFiled: November 27, 1985Date of Patent: August 25, 1987Assignee: Martin Marietta CorporationInventor: Hermann B. Sequeira
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Patent number: 4677404Abstract: This is a transmission line particularly suitable for millimeter-wave transmission that comprises a dielectric guiding slab layer sandwiched between a dielectric substrate layer and a dielectric strip, the long axis of the dielectric strip defining the direction of transmission. The outer surfaces of the strip and the substrate are clad with a conducting layer.Type: GrantFiled: December 19, 1984Date of Patent: June 30, 1987Assignee: Martin Marietta CorporationInventor: Hermann B. Sequeira
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Patent number: 4538276Abstract: Modulation depths in excess of 50% are achieved in well designed devices employing a laser diode for the conversion of modulating microwave signals into optical signals, by providing for suppression of microwave signals adventitiously present in the optical signal.Type: GrantFiled: July 27, 1982Date of Patent: August 27, 1985Assignee: University of DelawareInventors: Hermann B. Sequeira, Jay E. Taylor