Abstract: An optical system for a lithography system comprises: a number of optical elements for guiding radiation; a support device supporting the optical elements; and a plurality of active and/or passive components. The active and/or passive components are arranged on the support device in at least two different planes. The active and/or passive components are arranged on one side of the support device.

Abstract: A mirror arrangement, for example for a lithography system, comprises: a plurality of mirror elements, for example in the form of MEMS mirror modules, for reflecting radiation; a plurality of carrier elements, each having a head region for accommodating one of the mirror elements; and a mount arrangement comprising insert openings, which are designed to accommodate a respective seat portion of the carrier elements. The plurality of carrier elements are accommodated with the seat portions in the insert openings in the mount arrangement. Each carrier element comprises a channel device for guiding a coolant, which comprises an inlet for the coolant and an outlet for the coolant.

Abstract: An assembly for an optical system having a mirror array having a plurality of mirror elements arranged on a first carrier. The first carrier contains control leads to the mirror elements. A first heat transport path can dissipate heat from the mirror array to a cooling mechanism during the operation of the optical system. At least one second heat transport path dissipates heat from the mirror array to a cooling mechanism during the operation of the optical system. The first heat transport path and the at least one second heat transport path are spatially separated from one another at least in regions. The first heat transport path extends via an interface component. The first heat transport path extends via the first carrier and the interface component from the mirror array to a cooling mechanism surrounding the interface component.

Abstract: A mirror arrangement, in particular for a microlithographic projection exposure apparatus, includes at least one mirror element bearing a mirror surface provided for reflecting electromagnetic radiation, at least one carrier element including a head section, which is provided for receiving at least one mirror element, and also a seat section. The arrangement further includes a mount arrangement, for receiving the at least one carrier element. At least one insertion opening is in the mount arrangement. The seat section of the carrier element plunges into the insertion opening. In addition, the arrangement includes a channel device for guiding a heat transfer medium is formed in the mount arrangement in the region surrounding the seat section. A method for dissipating heat is provided.

Abstract: A projection exposure apparatus for semiconductor lithography has a mirror arrangement that is exposed to thermal loads in operation. The mirror arrangement includes a mirror carrier having an optically active surface arranged on a top surface of the mirror carrier. A cooling system is integrated into the mirror carrier. The cooling system has cooling lines through which a cooling fluid circulates. The cooling system is designed so that the thermal load introduced into the mirror carrier via the optically active surface is dissipated at least partially into a rear region remote from the top surface of the mirror carrier.

Abstract: A projection exposure apparatus for semiconductor lithography has a mirror arrangement that is exposed to thermal loads in operation. The mirror arrangement includes a mirror carrier having an optically active surface arranged on a top surface of the mirror carrier. A cooling system is integrated into the mirror carrier. The cooling system has cooling lines through which a cooling fluid circulates. The cooling system is designed so that the thermal load introduced into the mirror carrier via the optically active surface is dissipated at least partially into a rear region remote from the top surface of the mirror carrier.

Abstract: The invention relates to an optical imaging device, in particular an objective 1 for microlithography in the field of EUVL for producing semiconductor components, having a beam path 2, a plurality of optical elements 3 and a diaphragm device 7 with an adjustable diaphragm opening shape. The diaphragm device has a diaphragm store 7a, 7b with a plurality of different diaphragm openings 6 with fixed shapes in each case, which can be introduced into the beam path 2.

Abstract: A mirror arrangement, in particular for a microlithographic projection exposure apparatus, includes at least one mirror element bearing a mirror surface provided for reflecting electromagnetic radiation, at least one carrier element including a head section, which is provided for receiving at least one mirror element, and also a seat section. The arrangement further includes a mount arrangement, for receiving the at least one carrier element. At least one insertion opening is in the mount arrangement. The seat section of the carrier element plunges into the insertion opening. In addition, the arrangement includes a channel device for guiding a heat transfer medium is formed in the mount arrangement in the region surrounding the seat section. A method for dissipating heat is provided.

Abstract: The invention relates to an optical imaging device, in particular an objective 1 for microlithography in the field of EUVL for producing semiconductor components, having a beam path 2, a plurality of optical elements 3 and a diaphragm device 7 with an adjustable diaphragm opening shape. The diaphragm device has a diaphragm store 7a, 7b with a plurality of different diaphragm openings 6 with fixed shapes in each case, which can be introduced into the beam path 2.

Abstract: An optical module includes an aperture device and a support structure supporting the aperture device. The aperture device defines an aperture edge and an aperture plane. The aperture edge is adapted to define a geometry of a light beam passing the aperture device along an optical axis. The support structure is adapted to hold the aperture device in a defined manner when the aperture plane is inclined with respect to a horizontal plane. A temperature distribution prevails within the aperture device and at least one of the aperture device and the support structure is adapted to maintain at least one of a relative position of the aperture edge with respect to the optical axis and a geometry of the aperture edge substantially unaltered upon an introduction of a thermal energy into the aperture device, where the thermal energy being adapted to cause an alteration in the temperature distribution.

Abstract: An optical module includes an aperture device and a support structure supporting the aperture device. The aperture device defines an aperture edge and an aperture plane. The aperture edge is adapted to define a geometry of a light beam passing the aperture device along an optical axis. The support structure is adapted to hold the aperture device in a defined manner when the aperture plane is inclined with respect to a horizontal plane. A temperature distribution prevails within the aperture device and at least one of the aperture device and the support structure is adapted to maintain at least one of a relative position of the aperture edge with respect to the optical axis and a geometry of the aperture edge substantially unaltered upon an introduction of a thermal energy into the aperture device, where the thermal energy being adapted to cause an alteration in the temperature distribution.

Abstract: An optical module includes an aperture device and a support structure supporting the aperture device. The aperture device defines an aperture edge and an aperture plane. The aperture edge is adapted to define a geometry of a light beam passing the aperture device along an optical axis. The support structure is adapted to hold the aperture device in a defined manner when the aperture plane is inclined with respect to a horizontal plane. A temperature distribution prevails within the aperture device and at least one of the aperture device and the support structure is adapted to maintain at least one of a relative position of the aperture edge with respect to the optical axis and a geometry of the aperture edge substantially unaltered upon an introduction of a thermal energy into the aperture device, where the thermal energy being adapted to cause an alteration in the temperature distribution.

Abstract: An optical assembly supported in an arrangement, especially in an objective or in an illuminating or exposure system, in the interior of a housing comprising at least one optical element, especially a lens, a mirror, or an aperture, wherein the at least one element is influenceable by at least one manipulator is characterized in that the at least one manipulator is arranged either outside of the housing or in a holding means that is separated entirely or to a large extent by the help of a decoupling means, and that there is provided an effective coupling between the manipulator and the element to be influenced by the manipulator in the interior of the arrangement.

Abstract: The invention relates to an optical imaging device, in particular an objective 1 for microlithography in the field of EUVL for producing semiconductor components, having a beam path 2, a plurality of optical elements 3 and a diaphragm device 7 with an adjustable diaphragm opening shape. The diaphragm device has a diaphragm store 7a, 7b with a plurality of different diaphragm openings 6 with fixed shapes in each case, which can be introduced into the beam path 2.

Abstract: The invention relates to an optical imaging device, in particular an objective 1 for microlithography in the field of EUVL for producing semiconductor components, having a beam path 2, a plurality of optical elements 3 and a diaphragm device 7 with an adjustable diaphragm opening shape. The diaphragm device has a diaphragm store 7a, 7b with a plurality of different diaphragm openings 6 with fixed shapes in each case, which can be introduced into the beam path 2.

Abstract: An optical imaging device (PL), in particular an objective for semiconductor lithography, is provided with at least one system diaphragm. The system diaphragm comprises a multiplicity of mobile plates, which are rotatably mounted. The plates have a spherical curvature.

Abstract: An optical assembly supported in an arrangement, especially in an objective or in an illuminating or exposure system, in the interior of a housing comprising at least one optical element, especially a lens, a mirror, or an aperture, wherein the at least one element is influenceable by at least one manipulator is characterized in that the at least one manipulator is arranged either outside of the housing or in a holding means that is separated entirely or to a large extent by the help of a decoupling means, and that there is provided an effective coupling between the manipulator and the element to be influenced by the manipulator in the interior of the arrangement.

Abstract: An optical assembly supported in an arrangement, especially in an objective or in an illuminating or exposure system, in the interior of a housing comprising at least one optical element, especially a lens, a mirror, or an aperture, wherein the at least one element is influenceable by at least one manipulator is characterized in that the at least one manipulator is arranged either outside of the housing or in a holding means that is separated entirely or to a large extent by the help of a decoupling means, and that there is provided an effective coupling between the manipulator and the element to be influenced by the manipulator in the interior of the arrangement.

Abstract: An optical module includes an aperture device and a support structure supporting the aperture device. The aperture device defines an aperture edge and an aperture plane. The aperture edge is adapted to define a geometry of a light beam passing the aperture device along an optical axis. The support structure is adapted to hold the aperture device in a defined manner when the aperture plane is inclined with respect to a horizontal plane. A temperature distribution prevails within the aperture device and at least one of the aperture device and the support structure is adapted to maintain at least one of a relative position of the aperture edge with respect to the optical axis and a geometry of the aperture edge substantially unaltered upon an introduction of a thermal energy into the aperture device, where the thermal energy being adapted to cause an alteration in the temperature distribution.

Abstract: An optical assembly supported in an arrangement, especially in an objective or in an illuminating or exposure system, in the interior of a housing comprising at least one optical element, especially a lens, a mirror, or an aperture, wherein the at least one element is influenceable by at least one manipulator is characterized in that the at least one manipulator is arranged either outside of the housing or in a holding means that is separated entirely or to a large extent by the help of a decoupling means, and that there is provided an effective coupling between the manipulator and the element to be influenced by the manipulator in the interior of the arrangement.