Patents by Inventor Hermann Bloessl

Hermann Bloessl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for soldering components onto printed circuit boards
    Patent number: 5081336
    Abstract: A method wherein the component to be soldered is placed onto the printed circuit board, whereupon the stirrup electrodes of the soldering mechanism are lowered and the terminal legs of the component are pressed against the printed circuit board with a force. After heating the stirrup electrodes for melting the solder, a further advance of the stirrup electrodes ensues for impressing the terminal legs into the molten solder. The formation of a solder layer between terminal legs and printed circuit board subsequently ensues by reducing the force exerted onto the stirrup electrodes and/or by defined retraction of the stirrup electrodes.
    Type: Grant
    Filed: September 25, 1990
    Date of Patent: January 14, 1992
    Assignee: Siemens Aktiengesellschaft
    Inventors: Rudolf Schuster, Josef Raschke, Hermann Bloessl