Patents by Inventor Hermann Kasowski

Hermann Kasowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5965843
    Abstract: An injection-molded part (1) includes elevations (2) and/or depressions (12) arranged between integrated printed conductors (4). If the elevations (2) or depressions (12) are uncoated and thus electrically insulating, they increase the effective voltage clearances between the printed conductors (4) and the components (3) arranged next to the printed conductors (4). The geometric distances can then be reduced. Alternatively, by electroconductively coating the elevations (2), electric and magnetic shielding is achieved in a simple manner. A cover (6) is provided as a top of a box which uses elevations (2) as side walls. A tapering portion (5) connects coatings (7,7') of the cover (6) and elevations (2) via a printed conductor (8) running diagonally across the tapering portion (5).
    Type: Grant
    Filed: August 14, 1997
    Date of Patent: October 12, 1999
    Assignee: Siemens AG
    Inventors: Eduard Schonberger, Stefan Gruber, Hermann Kasowski, Heinz Schmidt
  • Patent number: 5468909
    Abstract: An insulating part for an electronic device includes a first metallized outer surface capable of cooling one or more electronic components disposed on the insulating part. The insulating part also includes one or more additional metallized outer surfaces, such as a set of cooling ribs, to provide improved cooling for the electronic components. These additional outer surfaces are coupled electrically and thermally to the first metallized outer surface, and to each other by recesses containing a heat transfer element, such as a metallization or a soldered connection. Thus, heat transferred to the first outer surface is further dissipated among the several additional cooling surfaces.
    Type: Grant
    Filed: January 21, 1994
    Date of Patent: November 21, 1995
    Assignee: Siemens Aktiensesellschaft
    Inventors: Eduard Schonberger, Stefan Gruber, Hermann Kasowski, Heinz Schmidt
  • Patent number: 5461201
    Abstract: An insulating part for an electronic device includes a body having a metallized outer surface and a heat sink arranged within the body. The heat sink is thermally coupled to an electronic component and to the metallized outer surface, and may also be either electrically coupled or electrically isolated from the electronic component. The insulating part is preferably made of plastic by an injection-molding process, while the heat sink is preferably a metal block integrally formed within the insulating part.
    Type: Grant
    Filed: January 21, 1994
    Date of Patent: October 24, 1995
    Assignee: Siemens Aktiengesellschaft
    Inventors: Eduard Schonberger, Stefan Gruber, Hermann Kasowski, Heinz Schmidt
  • Patent number: 5253144
    Abstract: Previously known circuit boards as components of devices having a housing have a plastic rear wall of the housing and the circuit board creates a connection between at least two printed circuit boards in the housing. Furthermore, processes for the production of three-dimensional printed circuits are known. Taking these as a point of departure, a one-piece circuit board as an integral portion of the housing of the device is created. One that not only produces the function of an electrically-conductive connection between the aforementioned printed circuit boards, but also serves as a mounting for the printed circuit boards, i.e., it can assume mechanical functions. This is solved by virtue of the fact that the rear wall (1) of the housing consists of plastic and embodies a circuit board having metallized strip conductors (2) and flat surfaces (3) that conduct electricity. And, on the interior of the rear wall (1), protruding connectors are moulded.
    Type: Grant
    Filed: August 6, 1992
    Date of Patent: October 12, 1993
    Assignee: Siemens Aktiengesellschaft
    Inventors: Eduard Schonberger, Hermann Kasowski, Heinz Schmidt
  • Patent number: 5067785
    Abstract: An electronic module includes a front fin, a printed circuit board having connected terminals, a status display including a plurality of fiber optic guides which lead into the fin and serve as light-emitting elements, a front panel connector, and a front door attached to the front panel connector. The fin may include a bar on a housing shell which projects to the front side and of a counterpart bar on a housing cover. The plurality of fiber optic guides may be combined into one fiber optic comb. A swivel may be used to connect the front panel connector to the module. Flexible hinges may be used to connect the front door to the front panel connector and to mount the light-emitting elements to the printed circuit board.
    Type: Grant
    Filed: September 21, 1990
    Date of Patent: November 26, 1991
    Assignee: Siemens Aktiengesellschaft
    Inventors: Reinhard Schirbl, Gunther Deinhardt, Hermann Kasowski
  • Patent number: D573098
    Type: Grant
    Filed: May 12, 2005
    Date of Patent: July 15, 2008
    Assignee: Siemens Aktiengesellschaft
    Inventors: Martin Bergmann, Markus Donderer, Hermann Kasowski, Stefan Preischl, Heribert Rester