Abstract: A resonator component module has circuitry contained in a dual-in-line package integrated circuit and a plate-shaped crystal resonator which is secured in place by upwardly bending opposite central leads of the dual-in-line package and forming the ends of the bent leads to receive and retain the plate. Appropriate other leads of the dual-in-line package are fixed to terminal pins held in a base plate to which external electrical connections are made. A protective cap is attached to the base plate to cover the integrated circuit and the resonator in a self-contained module.