Abstract: Stencils having enhanced wear-resistance consisting of a metal body, preferably fabricated from stainless steel, having a first major surface and a second major surface and a plurality of apertures extending through the metal body from the first major surface to the second major surface, and a diamond coating which is preferably applied to at least the top surface of the metal body, and to the side walls of the plurality of apertures. Such stencils are particularly useful for positioning solder paste in predetermined areas on contact pads of printing wiring boards. The diamond coating is preferably deposited on the stencil surfaces from a vapor phase of carbon-containing gases. By applying the diamond coating to the top and side wall surfaces of the stencil, improved wear-resistance is achieved, resulting in increased service life for the stencils.