Abstract: A pressure sensing device comprising a base element for fastening the pressure sensing device provided with a connecting duct for feeding a pressurized fluid. The pressure sensing device has a support member that extends along a plugging direction and is fitted with a plug-in connector section configured to be plugged into a complementary plug-in connector. The support member is connected to the base and is equipped with a pressure duct that is connected to the connecting duct, and encompasses a receiving hole which extends perpendicular to the plugging direction and communicates with the pressure duct. The pressure sensing device includes a pressure sensor element that is inserted into the receiving hole such that one of the surfaces of the pressure sensor element is exposed to pressure from the pressure duct, and is connected to contact elements for transmitting signals.

Abstract: A pressure sensing device comprising a base element for fastening the pressure sensing device provided with a connecting duct for feeding a pressurized fluid. The pressure sensing device has a support member that extends along a plugging direction and is fitted with a plug-in connector section configured to be plugged into a complementary plug-in connector. The support member is connected to the base and is equipped with a pressure duct that is connected to the connecting duct, and encompasses a receiving hole which extends perpendicular to the plugging direction and communicates with the pressure duct. The pressure sensing device includes a pressure sensor element that is inserted into the receiving hole such that one of the surfaces of the pressure sensor element is exposed to pressure from the pressure duct, and is connected to contact elements for transmitting signals.

Abstract: A method for encapsulating the electronic component and a method for producing electronic components according to the method include coating the component with a coating material. The coating material is hardened and an assembly including the component and the coating is encapsulated in plastic. In particular, the coating can be accomplished by immersion. The electronic component includes the coating encapsulation of a coating material applied in a flowable condition and hardened and a plastic encapsulation encapsulating the coating.

Abstract: A method for encapsulating the electronic component and a method for producing electronic components according to the method include coating the component with a coating material. The coating material is hardened and an assembly including the component and the coating is encapsulated in plastic. In particular, the coating can be accomplished by immersion. The electronic component includes the coating encapsulation of a coating material applied in a flowable condition and hardened and a plastic encapsulation encapsulating the coating.

Abstract: It is possible to dispense with a separate ambient pressure sensor. For that purpose, the ambient pressure pu is determined from the absolute pressure ps in the intake tract of an internal combustion engine, the intake air mass flow rate Q and the air temperature T, as well as a pressure loss coefficient Cb. Calibration of the value for the ambient pressure pu determined in this way when the internal combustion engine is idling or at a standstill makes it possible to diagnose an impermissibly contaminated air filter by deducing from the change in the pressure loss coefficient Cb.

Abstract: A porous Al.sub.2 O.sub.3 thick film covers the SrTiO.sub.3 layer of an oxygen sensor, said SrTiO.sub.3 layer being contacted by means of two Pt electrodes and deposited on an Al.sub.2 O.sub.3 substrate. The electrically insulating Al.sub.2 O.sub.3 layer bears a protective layer, which is exposed to the exhaust gas and is preferably also made of SrTiO.sub.3. This construction ensures that the output signal of the sensor representing the oxygen partial pressure then depends only on the resistance or, respectively, conductivity value of the non-contaminated SrTiO.sub.2 sensor layer.

Abstract: The invention relates to a device for holding a storage tank by tensile stress inside an object, especially a movable object, e.g., a satellite, aircraft or motor vehicle, in which the storage tank is used for the storage of liquid or gaseous fluids, whose temperature exhibits a difference of at least 10.degree. C., in particular 30.degree. C., preferably 50.degree. C., to the outside temperature of the object. Here, the holding device contains a molded part made of a shape memory alloy (memory metal), which in the case of comparatively high mechanical stresses, especially during the take-off or lift-off of an aircraft or satellite or the driving of a motor vehicle, results in an increase of tensile stress, and in the case of comparatively small mechanical stresses, especially during flying of an aircraft or satellite or the standing of a motor vehicle, results in a reduction of tensile stress.