Abstract: A transport monitoring system is provided for transporting goods that are provided with identification tags. The identification tags store identification data used to identify the goods. The transport device includes a closeable transport unit, at least one reader unit, an evaluation unit and activation unit. The closeable transport unit receives goods that are provided with identification tags. The at least one reader unit emits an inquiry signal to the transport unit in order to read the identification tags when an activation signal for activating the reader unit is received. The at least one reader unit also receives the identification data signals emitted by the identification tags. The evaluation unit is used to evaluate the identification data signals received by the reader unit. The activation unit produces the activating signal for activating the reader unit once the transport unit is closed.

Abstract: A transport monitoring system is provided for transporting goods that are provided with identification tags. The identification tags store identification data used to identify the goods. The transport device includes a closeable transport unit, at least one reader unit, an evaluation unit and activation unit. The closeable transport unit receives goods that are provided with identification tags. The at least one reader unit emits an inquiry signal to the transport unit in order to read the identification tags when an activation signal for activating the reader unit is received. The at least one reader unit also receives the identification data signals emitted by the identification tags. The evaluation unit is used to evaluate the identification data signals received by the reader unit. The activation unit produces the activating signal for activating the reader unit once the transport unit is closed.

Abstract: An electronic device includes a chip (10) and a carrier substrate (16), wherein the carrier substrate (16) has a conductive structure (18) and the chip (10) has a pair of bonding pads (13) on a side facing the carrier substrate (16). The bonding pads (13) are in electrical contact with the conductive structure (18). The chip (10) has a non-reductive space layer (14) on the side facing the carrier substrate (16), wherein the non-conductive space layer (14) defines the distance between the chip (10) and the conductive structure (16) of the carrier substrate (16).

Abstract: The invention is directed to an arrangement for generating a chemically active jet (active gas jet) by a plasma generated by electric discharge in a process gas. It is the object of the invention to find a novel possibility for generating a chemically active jet by a plasma generated by electric discharge in which high chemical activity develops at increased process gas velocity of the active gas jet on the surface to be treated and is electrically neutral already at the output of the arrangement, so that it does not pose a threat to the operating personnel, the environment and the treated surface. This object is met in that the discharge chamber has a conically narrowed end for increasing the velocity of the active gas jet, and a limiting channel for preventing propagation of the discharge zone into the free space for the surface to be treated is arranged following the narrowed end of the discharge chamber.

Abstract: An element for carrying out and documenting a program or test sequence allows specific functions to be carried out. The element has at least one control input to which an external control signal can be supplied, and a variable can be varied in the element as a function of the external control signal. The process of carrying out a particular function can be varied by the element in such a manner that, when the variable has a specific value (“0”) and the external control signal is at a first signal level, the variable assumes a value (not equal to “0”) which differs from the specific value; and when the variable is at that specific value and an external control signal which is at the first signal level is once again applied, the variable remains at that specific value.

Abstract: The invention relates to a shaped body and a method for producing such shaped bodies which have substantially more favourable physical and chemical properties and which can be used advantageously thereby in the most varied of application fields, particularly in the construction industry. The shaped bodies should be produced at low cost and higher strengths should be achieved than conventional materials, with as low bulk densities as possible. According to the invention, this object is achieved in that the shaped body is formed exclusively from lightweight aggregates which are sintered together. The lightweight aggregates are selected thereby from expanded glass granulate, expanded clay granulate, or thermally pre-expanded perlite or also from mixtures thereof. They are produced from the lightweight aggregate in granulate form, having a residual expanding agent content of at least 0.1% by mass.

Abstract: In a device for attaching a semiconductor chip (10) to a chip carrier (12), thereby producing an electrically conducting connection between contact areas (22, 24) arranged on a surface of the semiconductor chip (10) and contact areas (26, 28) on the chip carrier (12) by means of an anisotropically conducting film (16) or an anisotropically conducting paste (16), a pressure die (18) is used for the application of the pressure to the chip (10) with an adjustable pressing force against the chip carrier (12). A counter-pressure support (14) accepts the chip carrier (12) with the semiconductor chip (10) arranged on it with the interposition of the anisotropically conducting film (16) or the anisotropically conducting paste (16). An elastic body (20) is arranged either between the pressure die (14) and the semiconductor chip (10) or between the chip carrier (12) and the counter-pressure support (14).

Abstract: An element for carrying out and documenting a program or test sequence allows specific functions to be carried out. The element has at least one control input to which an external control signal can be supplied, and a variable can be varied in the element as a function of the external control signal. The process of carrying out a particular function can be varied by the element in such a manner that, when the variable has a specific value (“0”) and the external control signal is at a first signal level, the variable assumes a value (not equal to “0”) which differs from the specific value; and when the variable is at that specific value and an external control signal which is at the first signal level is once again applied, the variable remains at that specific value.

Abstract: The invention is directed to an arrangement for generating a chemically active jet (active gas jet) by a plasma generated by electric discharge in a process gas. It is the object of the invention to find a novel possibility for generating a chemically active jet by a plasma generated by electric discharge in which high chemical activity develops at increased process gas velocity of the active gas jet on the surface to be treated and is electrically neutral already at the output of the arrangement, so that it does not pose a threat to the operating personnel, the environment and the treated surface. This object is met in that the discharge chamber has a conically narrowed end for increasing the velocity of the active gas jet, and a limiting channel for preventing propagation of the discharge zone into the free space for the surface to be treated is arranged following the narrowed end of the discharge chamber.

Abstract: Device for attaching a semiconductor chip to a chip carrier In a device for attaching a semiconductor chip (10) to a chip carrier (12), thereby producing an electrically conducting connection between contact areas (22, 24) arranged on a surface of the semiconductor chip (10) and contact areas (26, 28) on the chip carrier (12) by means of an anisotropically conducting film (16) or an anisotropically conducting paste (16), a pressure die (18) is used for the application of the pressure to the chip (10) with an adjustable pressing force against the chip carrier (12). A counter-pressure support (14) accepts the chip carrier (12) with the semiconductor chip (10) arranged on it with the interposition of the anisotropically conducting film (16) or the anisotropically conducting paste (16). An elastic body (20) is arranged either between the pressure die (14) and the semiconductor chip (10) or between the chip carrier (12) and the counter-pressure support (14).

Abstract: A process for structuring polymer films, such as printed circuit boards and film boards, uses a plasma, which is formed in a container by the excitation of gas mixtures by microwaves, in which there is a control of the surface temperature of the polymer films during structuring by the plasma. By adjusting the parameters it is possible to operate just below a material-damaging temperature limit for polymer films, so that structures or microshapes are carefully plasma-eroded in polymer films. At high surface temperatures and with a dense plasma, structures or microshapes are rapidly eroded by the plasma, in which the structures or microshapes are homogeneously plasma-eroded with a uniform distribution of the surface temperature and gas flow.

Abstract: The present invention relates to a general method for increasing the energy conversion from metal-containing rocket and ramjet propellants. According to the invention, this is achieved by means of combining the combustion of the fuel with exothermic intermetallic alloying reactions between components incorporated in the fuel.The invention also concerns rocket and ramjet propellants formulated in accordance with the abovementioned method.

Abstract: The disclosure relates to an explosive charge intended for the explosive jointing of, primarily, large-diameter pipes, such as pipeline pipes. The charge according to the invention is intended to be delivered as a unit ready to be applied immediately on site in the pipe. The only item which is not intended to be included is the detonator which is mounted in place immediately prior to blowing the charge. The charge includes, apart from explosive, also a polymer binder of a more closely defined type and gas blisters preferably in the form of microspheres of glass or plastic and metal or metal oxide powder. The scope of the invention embraces the general configuration of the charge and all components included therein.

Abstract: The disclosure relates to a method for producing charges for explosive jointing of large-diameter pipes such as pipelines. According to the invention, such charges are formed in that a strip-shaped flat explosive is wound and joined together to form a circular ring of even thickness consisting of a plurality of closely abutting layers.

Abstract: An injection mold is described for producing the housings of integrated circuits. The injection mold icludes a first mold half (30) in which are disposed a number of mold recesses (46) corresponding to the number of housings to be made simultaneously, having a depth corresponding to a portion of the height of the housings, and supply passages (48, 50, 52, 54, 56, 58) leading to the mold recesses (46). In a second mold half (32) which is adapted to be brought in the closure direction into engagement with the first mold half (30) a number of mold recesses (76) equal to the number in the first mold half (30) are disposed in corresponding arrangement, the depth thereof being equal to the remaining portion of the height of the housings to be made. The mold recesses (46) in one of the mold halves (32) are disposed groupwise in mold portions (64) which are held in the one mold half (32) displaceably in the closure and opening direction.

Abstract: The invention relates to a general method of producing progressively burning deterrent-coated powder, more particularly propellant powder for weapons having barrels. According to the method a film-forming, preferably polymerizable deterrent substance is fed to the powder loosely or dispersed in a liquid phase which is thereafter driven off. The invention also relates to a method of giving a deterrent coating to granular powder or powder cut up in to short pieces (so-called tubular powder) in a fluidized bed. Finally, the invention relates to a special deterrent substance in the form of a water-dispersable polyurethane built up on an aliphatic isocyanate and a caprolacton polyester.

Abstract: The invention relates to a general method of producing progressively burning deterrent-coated powder, more particularly propellant powder for weapons having barrels. According to the method a film-forming, preferably polymerizable deterrent substance is fed to the powder loosely or dispersed in a liquid phase which is thereafter driven off. The invention also relates to a method of giving a deterrent coating to granular powder or powder cut up in to short pieces (so-called tubular powder) in a fluidized bed. Finally, the invention relates to a special deterrent substance in the form of a water-dispersable polyurethane built up on an aliphatic isocyanate and a caprolacton polyester.

Abstract: The processors in a redundant, multiprocessor system are synchronized at the minor frame level with a combination of hardware and a local software supervisory routine. Each processor includes an interface synchronizer unit which receives synchronizing pulses from a selected number of the processor synchronizer units at the end of each minor frame. Sync decision logic circuits in each synchronizer determine whether the synchronizing pulses arrive within a predetermined time period or "window" (2 usecs, for example) indicating synchronization between the processors. A control, processor "Interrupt", signal is generated whenever a majority (>2) of the four (4) sync signals are received at the end of the minor frame. The local processor then initiates the supervisory software routine, which checks the status of the synchronizer for failure indications, isolates and records the faulty sync pulses and then replaces any faulty processor with another processor.

Abstract: An optical fiber position sensor includes an optical fiber cable wound in the shape of a single layer, tightly wound coil, the coil being secured to a first member. A second member, which is linearly movable with respect to the first member, has fixed thereto an LED which is aimed at the coil such that radiation being emitted from the LED is injected approximately tangentially into the coil. Radiation being transmitted through the coil is attenuated as a function of the distance that it travels therethrough and as a result, radiation exiting the coil through the terminations is representative of the location of the movable member with respect to the fixed member.