Abstract: Described is a base material for dry-peelable wallpaper, having greater dimensional stability and improved printability. The problem is solved by a composite fiber web consisting of a voluminous first layer of fiber material, a thermoplastic polymer film, and a second, less voluminous layer of fiber material.

Abstract: A seat arrangement is provided for a motor vehicle with a first vehicle seat and a second vehicle seat that is arranged adjacent to the first vehicle seat in the transverse direction. The vehicle seats include, but are not are not limited to a seat part and a back rest. The first vehicle seat can be displaced in the transverse direction from a first position into a second position in which the first vehicle seat is offset in the direction of the second vehicle seat. The second vehicle seat can furthermore be folded from a service position into an idle position. The seat part of the second vehicle seat is lowered in the idle position such that the seat part of the first vehicle seat is arranged above the seat part of the second vehicle seat in the second position.

Abstract: A seat arrangement is provided for a motor vehicle with a first vehicle seat and a second vehicle seat that is arranged adjacent to the first vehicle seat in the transverse direction. The vehicle seats include, but are not are not limited to a seat part and a back rest. The first vehicle seat can be displaced in the transverse direction from a first position into a second position in which the first vehicle seat is offset in the direction of the second vehicle seat. The second vehicle seat can furthermore be folded from a service position into an idle position. The seat part of the second vehicle seat is lowered in the idle position such that the seat part of the first vehicle seat is arranged above the seat part of the second vehicle seat in the second position.

Abstract: The invention relates to a lead-free soft solder, especially for use in electronic and electrical engineering. The aim of the invention is to provide a lead-free soft solder which does not tend to form coarse tin dentrides, has a smooth and homogeneous surface once melted and is suitable for the use as BGA balls. This aim is achieved by using a lead-free Sn—Ag—Cu solder alloy which comprises a base alloy composed of 5.0 to 20% by weight silver, 0.8 to 1.2 %lt by weight copper, remainder tin and usual impurities. To this base alloy, 0.8 to 1.2% by weight indium and 0.01 to 0.2% by weight nickel, or instead of nickel either 0.01 to 0.2% by weight germanium or 0.01 to 0.2% by weight of one of the elements of the lanthanoids such as for example lanthane or neodym are added. The last-mentioned three variants may be combined with one another or each other in the form of a prealloy in such a manner that the sum thereof is 0.01 to 0.2% by weight.

Abstract: A pick-up device for products having round portions which can be gripped frictionally, ranging from heavy metal products having bores or round holes to thin-walled drinking glasses having round peripheries, has a cylindrical part which can be positioned radially opposite to the round portion, either by insertion or encirclement, and having a circumferential groove radially facing the portion. A cylindrical elastic elastomer ring is positioned loosely in the groove and has axially extending lip seals slidably engaging the groove's sides. Fluid pressure introduced to the groove behind the ring causes the ring to elastically deform towards and frictionally grip the round portion of the product to be picked up, and by the resiliency of the ring, to release the portion when the pressure is terminated.