Patents by Inventor Hermes Apale

Hermes Apale has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package
    Publication number: 20050006668
    Abstract: An embodiment of the present invention allows mold compound to flow underneath a substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities where the mold compound will remain in place and harden. After hardening, the mold compound surrounding a mold anchor will support an anchored area.
    Type: Application
    Filed: August 9, 2004
    Publication date: January 13, 2005
    Applicant: ST ASSEMBLY TEST SERVICES LTD.
    Inventors: Virgil Ararao, Hermes Apale, Il Shim