Patents by Inventor Herr Kim Eric Trinh Quoc

Herr Kim Eric Trinh Quoc has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrical contact element for an electrical connector having microstructured caverns under the contact surface
    Patent number: 11239593
    Abstract: An electrically conductive contact element for an electrical connector comprises a contact surface having a plurality of caverns arranged under the contact surface in a microstructure and an auxiliary material filled in the plurality of caverns.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: February 1, 2022
    Assignees: TE Connectivity Germany GmbH, Steinbeiss-Forschungszentrum
    Inventors: Michael Leidner, Frank Mucklich, Leander Reinert, Herr Kim Eric Trinh Quoc, Helge Schmidt, Stefan Thoss
  • Electrical Contact Element For An Electrical Connector Having Microstructured Caverns Under The Contact Surface
    Publication number: 20190173214
    Abstract: An electrically conductive contact element for an electrical connector comprises a contact surface having a plurality of caverns arranged under the contact surface in a microstructure and an auxiliary material filled in the plurality of caverns.
    Type: Application
    Filed: February 8, 2019
    Publication date: June 6, 2019
    Applicants: TE Connectivity Germany GmbH, Steinbeiss-Forschungszentrum
    Inventors: Michael Leidner, Frank Mucklich, Leander Reinert, Herr Kim Eric Trinh Quoc, Helge Schmidt, Stefan Thoss