Abstract: The transmitter or receiver comprises several transducers made opposite an aperture in a package.

Abstract: A method for manufacturing a contact between a semiconductor substrate and a doped polysilicon layer deposited on the substrate with an interposed insulating layer, wherein elements adapted to making the insulating layer permeable to the migration of dopants from the polysilicon layer to the substrate are implanted.

Abstract: The transistor includes an emitter region 17 disposed in a first isolating well 11, 150 formed in a semiconductor bulk. An extrinsic collector region 16 is disposed in a second isolating well 3, 150 formed in the semiconductor bulk SB and separated laterally from the first well by a bulk separator area 20. An intrinsic collector region is situated in the bulk separator area 20 in contact with the extrinsic collector region. An intrinsic base region 100 is formed which is thinner laterally than vertically and in contact with the intrinsic collector region and in contact with the emitter region through bearing on a vertical flank of the first isolating well facing a vertical flank of the second isolating well. An extrinsic base region 60 is formed which is substantially perpendicular to the intrinsic base region in the top part of the bulk separator area, and contact terminals C, B, E respectively in contact with the extrinsic collector region, the extrinsic base region, and the emitter region.

Abstract: A method of fabricating an integrated circuit including a monocrystalline silicon substrate, a layer of polycrystalline silicon on the top surface of the substrate and doped with at least two dopants with different rates of diffusion, in which method annealing is performed at a temperature and for a time such that a first dopant diffuses into a first zone and a second dopant diffuses into a second zone larger than the first zone.

Abstract: A MOS transistor with a drain extension includes an isolation block on the upper surface of a semiconductor substrate. The isolation block has a first sidewall next to the gate of the transistor, and a second sidewall that is substantially parallel to the first sidewall. The isolation block further includes a drain extension zone in the substrate under the isolation block, and a drain region in contact with the drain extension zone. The drain region is in the substrate but is not covered by the isolation block.

Abstract: The semiconductor device comprises a semiconductor substrate (SB) having locally at least one zone (ZL) terminating in the surface of the substrate and entirely bordered, along its lateral edges and its bottom, by an insulating material so as to be completely isolated from the rest of the substrate. The horizontal isolating layer may be a layer of constant thickness or a crenellated layer.

Abstract: The semiconductor device comprises a semiconductor substrate (SB) having locally at least one zone (ZL) terminating in the surface of the substrate and entirely bordered, along its lateral edges and its bottom, by an insulating material so as to be completely isolated from the rest of the substrate. The horizontal isolating layer may be a layer of constant thickness or a crenellated layer.

Abstract: A process for fabricating a metal-metal capacitor within an integrated circuit comprises the steps of: producing a first metal electrode, a second metal electrode, and a dielectric layer on top of a lower insulating layer; and depositing an upper insulating layer on top of the two metal electrodes and the dielectric layer. The integrated circuit comprises the insulating layer, a first metal layer which is on top of the lower insulating layer, and the upper insulating layer which is on top of the first metal layer. The capacitor comprises the first metal electrode, the second metal electrode, and the dielectric layer wherein each of the two metal electrodes is in contact with one side of the dielectric layer. The electrodes and the dielectric layer lie between the lower insulating layer, which supports a level of metallization (M1), and the upper insulating layer which covers this level of metallization.

Abstract: A method of determining the time for polishing the surface of an integrated circuit wafer on a polishing machine. A sample wafer is fabricated to include at least one high plateau and at least one low plateau joined by a sudden transition. At least one initial profile is topographically scanned, and the surface of the sample wafer is polished at a particular polishing pressure for a particular polishing time. The final profile of the polished layer is topographically scanned in the corresponding area, and the initial and final topographical scans of the sample wafer are converted into Fourier series. The surface of the wafer to be polished is topographically scanned, and the topographic scan of the wafer to be polished is converted into a Fourier series. The time for polishing the wafer to be polished is calculated from the Fourier series and the average thickness to be removed.

Abstract: A method of fabricating, from a first semiconductor substrate having two parallel main surfaces, a system including an islet of a semiconductor material surrounded by an insulative material and resting on another insulative material includes forming a layer of a first insulative material, and forming on the top main surface of the first semiconductor substrate a thin semiconductor layer forming the islet of semiconductor material. The thin semiconductor layer can be selectively etched relative to the first semiconductor substrate. A layer of a second insulative material is formed on exposed surfaces of the islet of semiconductor material and the thin semiconductor layer. The method further includes removing the first semiconductor substrate.

Abstract: A DRAM made in monolithic form, the cells of which each include a MOS transistor and a capacitor, a second electrode of which is common to all cells of a same row and is covered with an insulator, the insulator being coated with independent conductive elements distributed on a same horizontal plane, two neighboring elements being biased to respective high and low levels.

Abstract: A semiconductor device includes a chip forming an integrated circuit; a connection substrate; an internal coupling mechanism; and at least one optical communication system. The connection substrate comprises an external coupling mechanism for electrically coupling to a device other than the chip. The internal coupling mechanism electrically couples the integrated circuit to the external coupling mechanism. The at least one optical communication system comprises two optoelectronic parts. The first optoelectronic part is either an emitter or a receiver which is integrated into the chip and constitutes one component of the integrated circuit. The second optoelectronic part is borne by the connection substrate and is able to be externally connected to the connection substrate. The second optoelectronic part faces the first optoelectronic part and is capable of exchanging light signals with the first optoelectronic part.

Abstract: A semiconductor device having separated exchange mechanism comprises a chip forming an integrated circuit; a connection substrate; device connection points or balls; and at least one exchange mechanism. The connection substrate comprises an external connection mechanism. The device connection points or balls are distributed in the form of a matrix and are located between the juxtaposed faces of the chip and of the connection substrate. The device connection points are connected to the external connection mechanism. The exchange mechanism comprises two parts. The two parts are arranged so as to be separated from each other and capable of exchanging signals between each other, in one or both directions. The first part is physically coupled to the chip. The second part is physically coupled to the connection substrate and is connected to the external connection mechanism.

Abstract: A invention provides a transformer for use in integrated circuits, comprising four layers of conductive lines, separated from each other by first, second and third insulating layers. First conductive vias traverse the second insulating layer to connect said second and third pluralities of conducting lines, to form a first winding. Second conductive vias traverse the first, second and third insulating layers to connect said first and fourth pluralities of conducting lines to form a second winding, about and approximately concentric with said first winding.