Patents by Inventor Herve Gris

Herve Gris has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Forming low k dielectric layers
    Patent number: 7205246
    Abstract: A low k dielectric layer is formed by depositing an unset dielectric layer on a substrate, the dielectric layer including Silicon, Carbon and Oxygen. The surface of the dielectric layer exposed to an activated gas to form a semi-permeable skin on or of the surface of the layer. The layer is then cured to render at least part of the layer porous.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: April 17, 2007
    Assignee: Aviza Technology Limited
    Inventors: John MacNeil, Sajid Ishaq, Hervé Gris, Katherine Giles
  • Forming low k dielectric layers
    Publication number: 20030124870
    Abstract: A low k dielectric layer is formed by depositing an unset dielectric layer on a substrate, the dielectric layer including Silicon, Carbon and Oxygen. The surface of the dielectric layer exposed to an activated gas to form a semi-permeable skin on or of the surface of the layer. The layer is then cured to render at least part of the layer porous.
    Type: Application
    Filed: November 18, 2002
    Publication date: July 3, 2003
    Inventors: John Macneil, Sajid Ishaq, Herve Gris, Katherine Giles