Abstract: An optical mode coupler for mode coupling of waveguides. The optical mode coupler includes an oxide cladding layer, a waveguide channel formed on the oxide cladding layer, and a waveguide portion formed on the oxide cladding layer and partially enclosed by the waveguide channel on an end of the waveguide portion. The waveguide portion has a tapered region located on the end of the waveguide portion. The tapered region has a dual-plane tapering arrangement extending from the waveguide portion towards the waveguide channel for enhanced mode transformation efficiency.

Abstract: Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Abstract: Optical connectors are described. The optical connectors may be configured to couple light beams and signals between optical components, for example, waveguides, optical fibers, transceivers, etc. The optical connectors may be configured to couple light beams with a transceiver of a photonic substrate. The connector may comprise a curved mirror. The curved mirror may be configured to interface light beams between an optical focusing element of the photonic substrate and a transceiver of the photonic substrate. A mode of the light beams may be converted.

Abstract: Systems, apparatuses, and methods for optical and electrical packaging of semiconductor dies are disclosed. The semiconductor packages may include a first semiconductor die and a second semiconductor die. A spacer may be disposed between the first and second semiconductor dies. The spacer may enable electrical and optical connection of the first and second semiconductor dies. The package may further include an optical fiber connected to one or more of the first or second semiconductor dies. The optical and electrical schemes used herein may enable compact, and convenient packaging of electronically and optically connected components.

Abstract: Electro-optical systems and methods are described including a photonic substrate optically coupled to a photonic integrated circuit (PIC). The photonic substrate and the PIC may comprise one or more optical elements. A mechanical aligner may be coupled to the photonic substrate. The mechanical aligner may be configured to align an optical element (e.g., optical fiber) to optically couple the optical element to the PIC via the one or more optical elements.

Abstract: Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Abstract: A connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip is provided. The connector comprises: a curved mirror; and a tilted flat mirror; wherein at least one of the curved mirror and the tilted flat mirror is formed on a hardened stamped imprint material that was deposited on the SiPh chip at least in a cavity thereof.

Abstract: Systems, apparatuses, and methods are described for semiconductor substrate probing and testing. Specifically, systems, apparatuses, and methods are described for electrically probing and optically probing a substrate in parallel. The parallel probing is enabled by a surface coupling optical arrangement utilizing a photonic bump.

Abstract: A wideband photonic bump (WBB), including: a positive taper of a polymer waveguide configured to further expand a light beam from an inverse taper to match a fiber optical mode of an optical fiber; a curved mirror formed on a surface of the WBB configured to reflect a light beam from the optical fiber; and a tilted flat mirror configured to direct the reflected light beam to an external optical fiber, wherein the WBB is coupled on the surface of a photonic integrated circuit (PIC).

Abstract: Systems, apparatuses, and methods for detachable fiber connector (FC) for optical coupling based on a coarse alignment and fine alignment are described. A photonic plug may be horizontally inserted into a receptacle and coarsely aligned with a photonic integrated circuit (PIC). The photonic plug may be moved vertically in the direction of the PIC. First fine alignment features, of the photonic plug, may engage second fine alignment features, associated with the PIC, aligning the photonic plug and the PIC. Systems, Mechanisms, and methods for retaining and for releasing the detachable connectors are also described.

Abstract: Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Abstract: Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Abstract: Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Abstract: Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Abstract: Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Abstract: Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Abstract: Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Abstract: A connector for use in coupling an optical signal between an optical fiber in an optical plug mounted to a bottom of a silicon photonics (SiPh) chip is provided. The connector comprises: a curved mirror; and a tilted flat mirror; wherein at least one of the curved mirror and the tilted flat mirror is formed on a hardened stamped imprint material that was deposited on the SiPh chip at least in a cavity thereof.

Abstract: A method comprising: stamping imprint material that was deposited on a silicon photonics (SiPh) chip and at least in a cavity thereof to form a curved mirror shape and a tilted flat mirror shape; coating at least a portion of each the curved mirror shape and the tilted flat mirror shape with a reflective material to form a first curved mirror and first tilted flat mirror; and mounting the SiPh chip in a flip-chip orientation to a substrate.

Abstract: An electro-optical system, and method for making the electro-optical system. The electro-optical system includes a Photonic Integrated Circuit (PIC) having a laser source located on the PIC, a fiberless optical coupler located on the PIC. The fiberless optical coupler is configured to be coupled to a fiber array. The electro-optical system also includes an optical element, and a mechanical aligner, for a light from the laser source to transmit in between the fiber array and the PIC through the optical element, when the fiberless optical coupler is coupled to the fiber array.