Patents by Inventor Hesham Y. Saleh Mraied

Hesham Y. Saleh Mraied has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electrodeposition of metal microstructures
    Patent number: 10450664
    Abstract: In one embodiment, an alloy microstructure structure includes a bottom plate made of an aluminum alloy, and a plurality of elongated pillars that extend from the bottom plate, the pillars being made of the aluminum alloy and having lengths no greater than 10 centimeters.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: October 22, 2019
    Assignee: University of South Florida
    Inventors: Hesham Y. Saleh Mraied, Wenjun Cai
  • Electrodeposition of metal microstructures
    Patent number: 10006134
    Abstract: In one embodiment, a method for fabricating a metal microstructure includes forming a non-conductive polymer membrane having a plurality of pores, coating at least one end of the membrane and inner surfaces of the pores with a conductive material to form a conductive coating, electrodepositing a metal on the conductive coating, and dissolving the membrane to obtain a free-standing metal microstructure having at least one metal end plate and multiple elongated metal members extending therefrom.
    Type: Grant
    Filed: November 7, 2015
    Date of Patent: June 26, 2018
    Assignee: University of South Florida
    Inventors: Hesham Y. Saleh Mraied, Wenjun Cai