Abstract: A low parasitic inductance power module, which includes an input power terminal, an output power terminal, a top metal insulating substrate, a bottom metal insulating substrate and a plastic package shell, wherein the input power terminal includes a positive power terminal and a negative power terminal, the top metal insulating substrate and the bottom metal insulating substrate are stacked, chips are sintered on faces of both the top metal insulating substrate and the bottom metal insulating substrate opposite to each other, and the positive power terminal, the negative power terminal, and the output power terminal are all electrically connected with the chips; and the output power terminal includes a welding portion and a connecting portion located outside the plastic package shell, and the welding portion is located between the top metal insulating substrate and the bottom metal insulating substrate.

Abstract: The invention discloses a parallel electrode combination, which includes a first power module electrode and a second power module electrode, wherein a soldering portion of the first power module electrode and a soldering portion of the second power module electrode are respectively used to connect a copper layer of a power source inside a power module, and a connecting portion of the first power module electrode and a connecting portion of the second power module electrode are opposite in parallel. The invention further discloses a power module and a power module group using the parallel electrode combination. In the invention, the connecting portion of the first power module electrode and the connecting portion of the second power module electrode are opposite in parallel.

Abstract: A low parasitic inductance power module, which includes an input power terminal, an output power terminal, a top metal insulating substrate, a bottom metal insulating substrate and a plastic package shell, wherein the input power terminal includes a positive power terminal and a negative power terminal, the top metal insulating substrate and the bottom metal insulating substrate are stacked, chips are sintered on faces of both the top metal insulating substrate and the bottom metal insulating substrate opposite to each other, and the positive power terminal, the negative power terminal, and the output power terminal are all electrically connected with the chips; and the output power terminal includes a welding portion and a connecting portion located outside the plastic package shell, and the welding portion is located between the top metal insulating substrate and the bottom metal insulating substrate.

Abstract: The invention discloses a parallel electrode combination, which includes a first power module electrode and a second power module electrode, wherein a soldering portion of the first power module electrode and a soldering portion of the second power module electrode are respectively used to connect a copper layer of a power source inside a power module, and a connecting portion of the first power module electrode and a connecting portion of the second power module electrode are opposite in parallel. The invention further discloses a power module and a power module group using the parallel electrode combination. In the invention, the connecting portion of the first power module electrode and the connecting portion of the second power module electrode are opposite in parallel.

Abstract: A combined electrode comprises a negative electrode, a first intermediate electrode, a positive electrode and a second intermediate electrode, wherein a main body portion of the negative electrode and a main body portion of the first intermediate electrode, a connection portion of the negative electrode and a connection portion of the first intermediate electrode, main body portions of the positive electrode and main body portions of the second intermediate electrode, and a connection portion of the positive electrode and a connection portion of the second intermediate electrode are arranged in parallel to and directly facing each other, thereby increasing a facing area between the negative electrode and the first intermediate electrode and between the positive electrode and the second intermediate electrode, reducing a current loop area between the negative electrode and the first intermediate electrode and between the positive electrode and the second intermediate electrode.

Abstract: A combined electrode comprises a negative electrode, a first intermediate electrode, a positive electrode and a second intermediate electrode, wherein a main body portion of the negative electrode and a main body portion of the first intermediate electrode, a connection portion of the negative electrode and a connection portion of the first intermediate electrode, main body portions of the positive electrode and main body portions of the second intermediate electrode, and a connection portion of the positive electrode and a connection portion of the second intermediate electrode are arranged in parallel to and directly facing each other, thereby increasing a facing area between the negative electrode and the first intermediate electrode and between the positive electrode and the second intermediate electrode, reducing a current loop area between the negative electrode and the first intermediate electrode and between the positive electrode and the second intermediate electrode.