Patents by Inventor Hesuk Jung

Hesuk Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible connection member and electronic device comprising same
    Patent number: 11523507
    Abstract: Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: December 6, 2022
    Assignees: Samsung Electronics Co., Ltd., SI FLEX CO., LTD.
    Inventors: Sungwon Park, Junghyub Kim, Hwanyoul Jeong, Seungyup Lee, Youngsun Lee, Hesuk Jung, Eunseok Hong
  • FLEXIBLE CONNECTION MEMBER AND ELECTRONIC DEVICE COMPRISING SAME
    Publication number: 20210329784
    Abstract: Various embodiments disclosed in the disclosure relate to a flexible connection member and an electronic device comprising same, the flexible connection member having an RF line for signal transmission formed therein, wherein an impedance of the RF line is prevented from being changed even when a flexible printed circuit board is bent.
    Type: Application
    Filed: August 9, 2019
    Publication date: October 21, 2021
    Inventors: Sungwon PARK, Junghyub KIM, Hwanyoul JEONG, Seungyup LEE, Youngsun LEE, Hesuk JUNG, Eunseok HONG
  • Electronic device including rigid-flex circuit board
    Patent number: 10827607
    Abstract: An electronic device includes first printed circuit board (PCB) structure including first layer including first conductive strip, second conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, and third conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, such that first conductive strip is between second conductive strip and third conductive strip, and second layer including first conductive layer, first insulating layer interposed between and in contact with first region of first layer and first region of second layer facing first region of first layer, second insulating layer interposed between second region of first layer abutting first region of first layer and second region of second layer abutting first region of second layer while contacting first layer, and third insulating layer interposed between second insulating layer and se
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: November 3, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sungwon Park, Seungyup Lee, Hesuk Jung
  • ELECTRONIC DEVICE INCLUDING RIGID-FLEX CIRCUIT BOARD
    Publication number: 20190269009
    Abstract: An electronic device includes first printed circuit board (PCB) structure including first layer including first conductive strip, second conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, and third conductive strip electrically separated from first conductive strip and extending at least partially in parallel with first conductive strip, such that first conductive strip is between second conductive strip and third conductive strip, and second layer including first conductive layer, first insulating layer interposed between and in contact with first region of first layer and first region of second layer facing first region of first layer, second insulating layer interposed between second region of first layer abutting first region of first layer and second region of second layer abutting first region of second layer while contacting first layer, and third insulating layer interposed between second insulating layer and se
    Type: Application
    Filed: February 25, 2019
    Publication date: August 29, 2019
    Inventors: Sungwon Park, Seungyup Lee, Hesuk Jung