Patents by Inventor Hetian Hou

Hetian Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12322849
    Abstract: Provided is a manufacturing method of a dielectric waveguide radio-frequency device, which relates to a manufacturing method of waveguide radio-frequency devices. The object of the present disclosure is to solve the issues of high costs, low processing efficiency, poor dimensional accuracy, poor surface quality, low device performance and inability to manufacture the ceramic waveguide radio-frequency devices in huge batches in the existing manufacturing method of the ceramic waveguide radio-frequency devices. The method includes: I. sectioning, II. slotting, III. processing tuning hole, IV. processing energy input hole, V. adhesive coating, stacking, VI. bonding, and VII. entire metallization, so as to obtain the dielectric waveguide radio-frequency device. In the present disclosure, more complex and diverse device topology structures can be manufactured, reducing the device manufacturing difficulty, and improving the accuracy allowance.
    Type: Grant
    Filed: May 21, 2024
    Date of Patent: June 3, 2025
    Assignee: TIANJIN UNIVERSITY
    Inventors: Bin Lin, Hetian Hou, Haoji Wang, Tianyi Sui
  • Publication number: 20240304977
    Abstract: Provided is a manufacturing method of a dielectric waveguide radio-frequency device, which relates to a manufacturing method of waveguide radio-frequency devices. The object of the present disclosure is to solve the issues of high costs, low processing efficiency, poor dimensional accuracy, poor surface quality, low device performance and inability to manufacture the ceramic waveguide radio-frequency devices in huge batches in the existing manufacturing method of the ceramic waveguide radio-frequency devices. The method includes: I. sectioning, II. slotting, III. processing tuning hole, IV. processing energy input hole, V. adhesive coating, stacking, VI. bonding, and VII. entire metallization, so as to obtain the dielectric waveguide radio-frequency device. In the present disclosure, more complex and diverse device topology structures can be manufactured, reducing the device manufacturing difficulty, and improving the accuracy allowance.
    Type: Application
    Filed: May 21, 2024
    Publication date: September 12, 2024
    Inventors: Bin LIN, Hetian Hou, Haoji Wang, Tianyi Sui