Abstract: The present invention relates to a dark-field examination device.

Abstract: Provided is an apparatus for measuring a three-dimensional profile using a LCD in which a sine wave pattern is formed on a measurement object, whereby image information of the measurement object is obtained using the sine wave pattern and a camera, and the image information is analyzed to measure a profile of the measurement object, the apparatus including a LCD projector including: a light source irradiating light forward; a LCD panel disposed at a front side of the light source, generating a sine wave pattern having a plurality of phases and a plurality of periods; polarization plates respectively disposed on front and rear sides of the LCD panel; a first focusing lens disposed apart from a front side of the LCD panel, focusing the sine wave pattern generated by the LCD panel on the measurement object; and a housing supporting the light source, the LCD panel, the polarization plates and the first focusing lens.

Abstract: The present invention relates to a dark-field examination device.

Abstract: A vision inspection system for inspecting an inspection object of various types, and an inspection method of inspecting an inspection object using the vision inspection system are disclosed. The vision inspection system comprises a work-piece stage having a table on which an inspection object is placed, a plurality of linescan cameras, and a computer configured to process a scanned image of the inspection object. A plurality of markings, each of which has a marking stage coordinate value, are provided on an upper surface of the table such that the linescan cameras can obtain scanned images of the markings. Each two neighboring markings are placed in a field of view of each of the linescan cameras. The markings between the first and the last markings are respectively placed in such a way as to overlap within the fields of view of each two neighboring linescan cameras.

Abstract: Disclosed is a system and a method for detecting and repairing alien materials on a semiconductor wafer. The system includes a transfer arm for transferring and aligning a wafer, an inspection unit, on which the wafer is seated, and which obtains an image of the wafer surface, an analysis module for analyzing the alien material appearing in the image obtained by the inspection unit, and a repair unit for repairing the alien material according to information regarding the analyzed alien material. The simple construction of the system and method for detecting and repairing alien materials on a wafer reduces the manufacturing cost, avoids the loss of manufacturing cost, and increases the semiconductor chip yield ratio.

Abstract: An automatic inspection system for camera lenses and method thereof using a line charge coupled device (CCD) which can process a signal easily and perceive a focal distance of lenses exactly by focusing automatically using a modulation transfer function (MTF) method when designing lenses. The automatic inspection system for camera lenses using a line CCD comprises a light source, a chart, a collimator, camera lenses, a mirror, an image pickup part, a signal converter, and a control part.