Patents by Inventor Heul-Seog Kim

Heul-Seog Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package transferring apparatus and method of manufacturing semiconductor device using the same
    Patent number: 8937483
    Abstract: A semiconductor package transferring apparatus is disclosed. The apparatus includes a tray that includes a front side and a rear side opposite the front side, the rear side including a plurality of package covering portions that each correspond to the shape of a semiconductor package and that are arranged to align with corresponding package loading portions on a front side of another tray. Each package covering portion has a surface configured to cover a semiconductor chip disposed below the surface. The apparatus further includes an anti-attachment portion disposed on the surface of one or more of the package covering portions. For each package covering portion on which an anti-attachment portion is disposed, the anti-attachment portion protrudes beyond the surface of the package covering portion.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: January 20, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyeck-Jin Jeong, Yong-Ki Park, Yong-Jin Jung, Heul-Seog Kim
  • SEMICONDUCTOR PACKAGE TRANSFERRING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20120043253
    Abstract: A semiconductor package transferring apparatus is disclosed. The apparatus includes a tray that includes a front side and a rear side opposite the front side, the rear side including a plurality of package covering portions that each correspond to the shape of a semiconductor package and that are arranged to align with corresponding package loading portions on a front side of another tray. Each package covering portion has a surface configured to cover a semiconductor chip disposed below the surface. The apparatus further includes an anti-attachment portion disposed on the surface of one or more of the package covering portions. For each package covering portion on which an anti-attachment portion is disposed, the anti-attachment portion protrudes beyond the surface of the package covering portion.
    Type: Application
    Filed: July 28, 2011
    Publication date: February 23, 2012
    Inventors: Hyeck-Jin Jeong, Yong-Ki Park, Yong-Jin Jung, Heul-Seog Kim