Abstract: A nitrogen oxide reduction type regenerative thermal oxidation system and a method for nitrogen oxide reduction thereof are disclosed. The nitrogen oxide reduction type regenerative thermal oxidation system according to the present invention is characterized by comprising: a first reduction device for primarily reducing nitrogen oxides generated by a regenerative thermal oxidation device based on a selective non-catalytic reduction method; an exhaust gas storage device for storing the exhaust gas being discharged from the regenerative thermal oxidation device; a second reduction device for secondarily reducing nitrogen oxides based on a selective catalytic reduction method for an exhaust gas stored in the exhaust gas storage device; and a suction and discharge device for sucking in the exhaust gas with secondarily reduced nitrogen oxides from the exhaust gas storage device and discharging it into the atmosphere.

Abstract: A multi-stage variable type waste heat storage and recovery apparatus and method thereof are disclosed. The apparatus includes a phase change material storage unit for separating and arranging a plurality of phase change materials having different melting points, and arranging them in stages on a path of the waste heat so that a phase change material having a higher melting point is located closer to an inlet side of the waste heat; a use place registration unit; a temperature range storage unit; a phase change material selection unit for selecting a phase change material of a corresponding melting point; and a heat energy supply unit for supplying heat energy by the latent heat of the phase change material selected by the phase change material selection unit to a corresponding heat energy use place among a plurality of heat energy use places.

Abstract: An exemplary system for controlling electrodeposition coating for electrochemically forming a coating film on a coating object in an electrodeposition tank storing electrodeposition solution includes, a positive electrode configured to apply a positive electrode voltage to a positive electrode disposed in the electrodeposition tank, a negative electrode configured to apply a negative electrode voltage to the coating object transferred by a hanger, and an electrodeposition controller configured to electrochemically deposit the coating film on an external surface and an internal surface of the coating object by applying the positive electrode voltage to the positive electrode and the negative electrode voltage to the negative electrode, where the electrodeposition controller may be configured to control voltage, current, and pulse in multi-stages over time from a dip-in time point to a draw-out time point of the coating object into and from the electrodeposition tank.

Abstract: Embodiments of the invention relate to a stage leveling device for a high-performance mask aligner, having enhanced leveling maintenance and, in particular, a novel technology of preventing leveling misalignment by firmly fixing a leveling-completed wafer stage. The stage leveling device, according to an embodiment of the invention addresses the problems experienced by conventional leveling devices. According to at least one embodiment, when a locking ring inserted at an outer side of a leveling rod maintains an inclined state, locking is performed such that an inner circumferential surface of the locking ring fixes opposite sides of the leveling rod by applying pressure thereto and, when the locking ring maintains a horizontal state, unlocking is performed such that the inner circumferential surface of the locking ring is spaced apart from the leveling rod.

Abstract: There is provided a scan and step exposure system to enable to perform the exposure on a large-sized subject to be exposed such as a film and a wafer, which was difficult to perform circuit patterning process on at one time, by transferring an exposure module by step feed way or making it moved continuously like scanning way in such way that an exposure subject is adsorbed on a chuck tray drawn out of the system body and the chuck tray is put into the body and placed under a mask holder, and a glass base having a film mask having circuit patterns adsorbed thereon is mounted on the mask holder, and the distance between the glass base and the exposure subject is controlled while moving the mask holder up and down, and the exposure process is performed while moving the exposure module located above the mask holder in the transverse direction continuously by scan way or by step feed way.

Abstract: There is provided a scan and step exposure system to enable to perform the exposure on a large-sized subject to be exposed such as a film and a wafer, which was difficult to perform circuit patterning process on at one time, by transferring an exposure module by step feed way or making it moved continuously like scanning way in such way that an exposure subject is adsorbed on a chuck tray drawn out of the system body and the chuck tray is put into the body and placed under a mask holder, and a glass base having a film mask having circuit patterns adsorbed thereon is mounted on the mask holder, and the distance between the glass base and the exposure subject is controlled while moving the mask holder up and down, and the exposure process is performed while moving the exposure module located above the mask holder in the transverse direction continuously by scan way or by step feed way.