Abstract: The present invention provides a high yield pathway for the fabrication, transfer and assembly of high quality printable semiconductor elements having selected physical dimensions, shapes, compositions and spatial orientations. The compositions and methods of the present invention provide high precision registered transfer and integration of arrays of microsized and/or nanosized semiconductor structures onto substrates, including large area substrates and/or flexible substrates. In addition, the present invention provides methods of making printable semiconductor elements from low cost bulk materials, such as bulk silicon wafers, and smart-materials processing strategies that enable a versatile and commercially attractive printing-based fabrication platform for making a broad range of functional semiconductor devices.

Abstract: The present invention relates to pyrrole derivatives and photosensitive film using the same and more particularly, the pyrrole derivatives consist of pyrrole units to allow polymerization chemically and electrochemically and a perylene diimide unit to absorb light so that perylene diimide film can be produced by crosslinking the pyrrole units by irradiation of visible light having wavelengths longer than 500 nm and become insoluble in most solvents. Such perylene diimide films can be widely used in the manufacture of electrical, electronical and optical devices such as photo diodes, solar batteries, liquid crystal displays, and luminescent diodes, etc.