Abstract: Disclosed herein is a method for manufacturing a package structure. According to an exemplary embodiment of the present invention, the method for manufacturing a package structure includes: preparing a die having a metal pillar disposed on one surface thereof; bonding the die on the metal plate to allow the metal pillar to face the outside; forming an insulating film covering the metal plate and the die; buffing the insulating film so as to expose the metal pillar; and manufacturing a first package structure by forming a circuit structure electrically connected to the metal pillar on the insulating film.

Abstract: Disclosed herein are a package board and a method of manufacturing the same. The package board includes: an insulating layer; and a ground layer formed in the insulating layer, wherein one side of the ground layer is formed so that a plurality of pattern parts having a plurality of diameters are spaced apart from each other and the other side thereof is continuously formed.

Abstract: Disclosed herein is a method for manufacturing a package structure. According to an exemplary embodiment of the present invention, the method for manufacturing a package structure includes: preparing a die having a metal pillar disposed on one surface thereof; bonding the die on the metal plate to allow the metal pillar to face the outside; forming an insulating film covering the metal plate and the die; buffing the insulating film so as to expose the metal pillar; and manufacturing a first package structure by forming a circuit structure electrically connected to the metal pillar on the insulating film.

Abstract: Disclosed herein are a package and a method for manufacturing the same. The package includes: a first package including a first printed circuit board having a first surface and a second surface and having a first die mounted on the first surface, the first die having a through silicon via; a second package including a second printed circuit board having a first surface and a second surface and having a second die mounted on the first surface, the second die having a through silicon via; first external connecting terminals electrically interconnecting the first surface of the first printed circuit and the first surface of the second printed circuit disposed to be opposite to each other; and first connecting bumps electrically interconnecting the first and second dice. Therefore, power signals are independently applied to each of the dice, thereby making it possible to improve power stability of each of the dice.

Abstract: Disclosed herein are a package and a method for manufacturing the same. The package includes: a first package including a first printed circuit board having a first surface and a second surface and having a first die mounted on the first surface, the first die having a through silicon via; a second package including a second printed circuit board having a first surface and a second surface and having a second die mounted on the first surface, the second die having a through silicon via; first external connecting terminals electrically interconnecting the first surface of the first printed circuit and the first surface of the second printed circuit disposed to be opposite to each other; and first connecting bumps electrically interconnecting the first and second dice. Therefore, power signals are independently applied to each of the dice, thereby making it possible to improve power stability of each of the dice.