Patents by Inventor Heung-Nam Han
Heung-Nam Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230024857Abstract: Provided is a method of forming a sintered metal, the method including a first step of inserting tungsten (W) powder in a graphite mold, a second step of interposing tantalum (Ta) foil between the W powder and the graphite mold, and a third step of forming sintered W from the W powder through a sintering process.Type: ApplicationFiled: January 20, 2021Publication date: January 26, 2023Inventors: Heung Nam HAN, No Jun KWAK, Yeon Ju OH, Guen Sik MIN
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Patent number: 11377716Abstract: Provided is a cermet having improved toughness, the cermet including particles each of which has a complete solid-solution carbide of two or more metals selected, including titanium, from among Group IVa, Va, and VIa metals in the periodic table and has a core/rim structure composed of a core region and a rim region, and a binder composed of a metal, wherein the composition of the Group VIa metal in the core region is lower than the composition in the rim region, and the lattice constant in the rim region is larger than that in the core region.Type: GrantFiled: March 19, 2019Date of Patent: July 5, 2022Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATIONInventors: Shinhoo Kang, Heung Nam Han, Choongkwon Park, Nojun Kwak
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Publication number: 20220072608Abstract: One embodiment of the present invention provides a sintering apparatus for selectively applying electric current, comprising: a mold provided with a space for accommodating a target object; a punch for uniaxially pressing the space of the mold; an electric controller provided at an end of the punch opposite to the pressing direction; an electrode unit in contact with the electric controller; and a heater extending from the electrode unit so as to heat the mold, wherein the mold and the punch are formed with a conductor.Type: ApplicationFiled: November 5, 2019Publication date: March 10, 2022Applicant: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATIONInventors: Jong-Hun RYU, Chan PARK, Mi-Young KIM, Heung-Nam HAN, Jun-Young CHO, Woo-Chan JIN
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Publication number: 20210394298Abstract: An electrically assisted pressure joining apparatus and an electrically assisted pressure joining method join a first metal member and a second metal member together, and includes an electrode portion, an intermediate portion including a plurality of micropores and inserted between a first metal member and a second metal member, and a pressure portion connected to the electrode portion to receive a current from the electrode portion and transfer the current to the first metal member and the second metal member to apply a pressure to the first metal member such that the first metal member and the second metal member are joined together by the intermediate portion.Type: ApplicationFiled: November 14, 2018Publication date: December 23, 2021Applicants: UNIVERSITY OF ULSAN FOUNDATION FOR INDUSTRY COOPERATION, SEOUL NATIONAL UNIVERSITY R&DB FOUNDATIONInventors: Sung-Tae HONG, Doo-Man CHUN, Hong-Seok PARK, Heung Nam HAN, Ju Won PARK, Yongfang LI, Dinh Son NGUYEN
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Publication number: 20210245283Abstract: A method of joining a high entropy alloy is provided. The method of joining a high entropy alloy includes the steps of: arranging specimens made of a high entropy alloy to be in contact with each other; and diffusion joining the specimens made of the high entropy alloy by simultaneously applying a compressive stress and a current to a joint of the specimens within a range in which the high entropy alloy does not melt.Type: ApplicationFiled: February 4, 2021Publication date: August 12, 2021Applicants: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION, University of Ulsan Foundation For Industry Cooperation, KOREA INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Heung Nam HAN, Min Gu JO, Sung Tae HONG, Nguyen Thi Anh Nguyet, Jin-Yoo SUH
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Patent number: 10857594Abstract: Provided is a method for producing a metal sintered body. The method for producing a metal sintered body in accordance with an embodiment includes (a) disposing a metal powder in a chamber of a spark plasma sintering apparatus, (b) applying a electric current to the metal powder to raise a temperature inside the chamber from a standby temperature to a first sintering temperature, (c) lowering the temperature inside the chamber to a second sintering temperature lower than the first sintering temperature and performing sintering, and (d) lowering the temperature inside the chamber from the second sintering temperature to the standby temperature.Type: GrantFiled: May 4, 2018Date of Patent: December 8, 2020Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATIONInventors: Jong Hyun Choi, Hyun Min Sung, Seong Hyeon Hong, Heung Nam Han
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Publication number: 20200140977Abstract: Provided is a cermet having improved toughness, the cermet including particles each of which has a complete solid-solution carbide of two or more metals selected, including titanium, from among Group IVa, Va, and VIa metals in the periodic table and has a core/rim structure composed of a core region and a rim region, and a binder composed of a metal, wherein the composition of the Group VIa metal in the core region is lower than the composition in the rim region, and the lattice constant in the rim region is larger than that in the core region.Type: ApplicationFiled: March 19, 2019Publication date: May 7, 2020Inventors: Shinhoo Kang, Heung Nam Han, Choongkwon Park, Nojun Kwak
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Publication number: 20180326483Abstract: Provided is a method for producing a metal sintered body. The method for producing a metal sintered body in accordance with an embodiment includes (a) disposing a metal powder in a chamber of a spark plasma sintering apparatus, (b) applying a electric current to the metal powder to raise a temperature inside the chamber from a standby temperature to a first sintering temperature, (c) lowering the temperature inside the chamber to a second sintering temperature lower than the first sintering temperature and performing sintering, and (d) lowering the temperature inside the chamber from the second sintering temperature to the standby temperature.Type: ApplicationFiled: May 4, 2018Publication date: November 15, 2018Inventors: Jong Hyun CHOI, Hyun Min SUNG, Seong Hyeo HONG, Heung Nam HAN
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Publication number: 20160222501Abstract: Provided is a post-treatment method of a film-coated member, the method including heating an electrically conductive film provided on at least one surface of a substrate by applying pressure to a member including the substrate and the film and applying a high-frequency direct current pulse to the film, wherein the pressure is applied in a direction having a normal-vector-direction component of a layer of the film.Type: ApplicationFiled: January 19, 2016Publication date: August 4, 2016Inventors: Heung Nam HAN, You Jung LEE, Hyun Min SUNG
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Patent number: 9337021Abstract: Provided are a thin film structure capable of remarkably reducing the defect density of gallium nitride (GaN), and a method of fabricating the same. The thin film structure includes a supporting substrate including sapphire, and an epilayer disposed on the supporting substrate and including gallium nitride (GaN). An upper part of the supporting substrate facing the epilayer includes a layer of sapphire into which silicon (Si) is diffused or ion-implanted through a top surface of the supporting substrate.Type: GrantFiled: February 18, 2014Date of Patent: May 10, 2016Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATIONInventors: Heung Nam Han, Sung Bo Lee
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Publication number: 20150325658Abstract: Provided are a thin film structure capable of remarkably reducing the defect density of gallium nitride (GaN), and a method of fabricating the same. The thin film structure includes a supporting substrate including sapphire, and an epilayer disposed on the supporting substrate and including gallium nitride (GaN). An upper part of the supporting substrate facing the epilayer includes a layer of sapphire into which silicon (Si) is diffused or ion-implanted through a top surface of the supporting substrate.Type: ApplicationFiled: February 18, 2014Publication date: November 12, 2015Inventors: Heung Nam HAN, Sung Bo LEE
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Patent number: 8658902Abstract: An electrical transmission line for transmitting electricity is made of a composite material in which aluminum and a plurality of carbon nanotubes are combined, and a weight ratio of the carbon nanotubes to the aluminum is 0.5 to 3 wt %. The carbon nanotubes are oriented at an angle within 30° along a length direction of the electrical transmission line.Type: GrantFiled: March 16, 2011Date of Patent: February 25, 2014Assignee: LS Cable Ltd.Inventors: Jeong-Ik Kim, Sang-Gyum Kim, Il-Jo Kwak, Heung-Nam Han
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Publication number: 20110226509Abstract: An electrical transmission line for transmitting electricity is made of a composite material in which aluminum and a plurality of carbon nanotubes are combined, and a weight ratio of the carbon nanotubes to the aluminum is 0.5 to 3 wt %. The carbon nanotubes are oriented at an angle within 30° along a length direction of the electrical transmission line.Type: ApplicationFiled: March 16, 2011Publication date: September 22, 2011Inventors: Jeong-Ik KIM, Sang-Gyum Kim, Il-Jo Kwak, Heung-Nam Han
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Patent number: 7325430Abstract: Disclosed herein is a method for improving the formability of an aluminum alloy sheet by locally modifying the surface of the aluminum alloy sheet. The method comprises: a sheet fixing step of fixing a sheet to be locally surface-modified; and a local surface modification step comprising adhering a probe closely to a region of the fixed sheet, which is in need of surface modification, by the application of pressure, and then rotationally moving the probe on the region at high speed. According to the method, the region of the sheet in which a fracture can occur due to the concentration of strains and stresses during the formation of the aluminum alloy sheet into a product is subjected to local surface modification so as to improve the formability of the aluminum alloy sheet compared to the parent metal, so that the aluminum alloy sheet can be easily formed into a product.Type: GrantFiled: August 28, 2006Date of Patent: February 5, 2008Assignee: Korea Institute of Machinery & MaterialsInventors: Chang-Gil Lee, Sung-Joon Kim, Heung-Nam Han, Kwan-Soo Chung, Sang-Joon Park
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Publication number: 20070051444Abstract: Disclosed herein is a method for improving the formability of an aluminum alloy sheet by locally modifying the surface of the aluminum alloy sheet. The method comprises: a sheet fixing step of fixing a sheet to be locally surface-modified; and a local surface modification step comprising adhering a probe closely to a region of the fixed sheet, which is in need of surface modification, by the application of pressure, and then rotationally moving the probe on the region at high speed. According to the method, the region of the sheet in which a fracture can occur due to the concentration of strains and stresses during the formation of the aluminum alloy sheet into a product is subjected to local surface modification so as to improve the formability of the aluminum alloy sheet compared to the parent metal, so that the aluminum alloy sheet can be easily formed into a product.Type: ApplicationFiled: August 28, 2006Publication date: March 8, 2007Inventors: Chang-Gil Lee, Sung-Joon Kim, Heung-Nam Han, Kwan-Soo Chung, Sang-Joon Park
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Publication number: 20050072832Abstract: Disclosed is a friction sheet welding method using a probe for joining two work pieces. The method comprises the steps of producing forcible and intense plastic deformation at surfaces of the work pieces while generating frictional heat at the surfaces by rotating the probe at a high speed, joining the work pieces together as the plastic deformation produced at the surfaces of the work pieces permeates inside material of the work pieces, and continuously welding the work pieces by horizontally traversing the probe along a weld joint between the work pieces.Type: ApplicationFiled: November 18, 2003Publication date: April 7, 2005Applicant: Korea Institute of Machinery and MaterialsInventors: Heung-Nam Han, Chang-Gil Lee, Sung-Joon Kim