Patents by Inventor Heung-su Gang

Heung-su Gang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package having implantable conductive lands and method for manufacturing the same
    Patent number: 6566168
    Abstract: A semiconductor package having implantable conductive lands for simplifying the manufacture of the semiconductor package, reducing the manufacturing cost by reducing the price of raw materials and improving the electrical, thermal and mechanical performance of the semiconductor package, and a method for manufacturing the same are provided. The semiconductor package includes a semiconductor package body and implantable conductive lands fixed in the semiconductor package body and taken off a tape film serving as a substrate of the semiconductor package until a molding process is completed. The tape film that has served as the substrate is taken off and removed from the semiconductor package body after the molding process so that the semiconductor package body does not include a substrate therewithin.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: May 20, 2003
    Assignee: KOSTAT Semiconductor Co., Inc.
    Inventor: Heung-su Gang
  • Tape having implantable conductive lands for semiconductor packaging process and method for manufacturing the same
    Patent number: 6534849
    Abstract: A tape having implantable conductive lands, which realizes a new structure in which an organic rigid substrate is removed from a semiconductor package in a semiconductor packaging process, and a method for manufacturing the tape are provided. The tape includes a tape film, which can be detached from a semiconductor package after an encapsulation process and serves as a general rigid substrate until the encapsulation process is completed, and implantable conductive lands adhering to the tape film.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: March 18, 2003
    Assignee: KOSTAT Semiconductor Co., Ltd.
    Inventor: Heung-su Gang
  • Tape having implantable conductive lands for semiconductor packaging process and method for manufacturing the same
    Patent number: 6507096
    Abstract: A tape having implantable conductive lands, which realizes a new structure in which an organic rigid substrate is removed from a semiconductor package in a semiconductor packaging process, and a method for manufacturing the tape are provided. The tape includes a tape film, which can be detached from a semiconductor package after an encapsulation process and serves as a general rigid substrate until the encapsulation process is completed, and implantable conductive lands adhering to the tape film.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: January 14, 2003
    Assignee: Kostat Semiconductor Co., Ltd.
    Inventor: Heung-su Gang
  • Semiconductor package having implantable conductive lands and method for manufacturing the same
    Patent number: 6429508
    Abstract: A semiconductor package having implantable conductive lands for simplifying the manufacture of the semiconductor package, reducing the manufacturing cost by reducing the price of raw materials and improving the electrical, thermal and mechanical performance of the semiconductor package, and a method for manufacturing the same are provided. The semiconductor package includes a semiconductor package body and implantable conductive lands fixed in the semiconductor package body and taken off a tape film serving as a substrate of the semiconductor package until a molding process is completed. The tape film that has served as the substrate is taken off and removed from the semiconductor package body after the molding process so that the semiconductor package body does not include a substrate therewithin.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: August 6, 2002
    Assignee: Kostat Semiconductor Co., Ltd.
    Inventor: Heung-su Gang
  • Tape having implantable conductive lands for semiconductor packaging process and method for manufacturing the same
    Publication number: 20020048948
    Abstract: A tape having implantable conductive lands, which realizes a new structure in which an organic rigid substrate is removed from a semiconductor package in a semiconductor packaging process, and a method for manufacturing the tape are provided. The tape includes a tape film, which can be detached from a semiconductor package after an encapsulation process and serves as a general rigid substrate until the encapsulation process is completed, and implantable conductive lands adhering to the tape film.
    Type: Application
    Filed: October 29, 2001
    Publication date: April 25, 2002
    Applicant: Kostat Semiconductor Co., Ltd.
    Inventor: Heung-Su Gang
  • Semiconductor package having implantable conductive lands and method for manufacturing the same
    Publication number: 20020041019
    Abstract: A semiconductor package having implantable conductive lands for simplifying the manufacture of the semiconductor package, reducing the manufacturing cost by reducing the price of raw materials and improving the electrical, thermal and mechanical performance of the semiconductor package, and a method for manufacturing the same are provided. The semiconductor package includes a semiconductor package body and implantable conductive lands fixed in the semiconductor package body and taken off a tape film serving as a substrate of the semiconductor package until a molding process is completed. The tape film that has served as the substrate is taken off and removed from the semiconductor package body after the molding process so that the semiconductor package body does not include a substrate therewithin.
    Type: Application
    Filed: December 12, 2001
    Publication date: April 11, 2002
    Inventor: Heung-su Gang