Abstract: In one aspect, the present disclosure relates to a quantum dot bead comprising a multifunctional ligand having a first binding material and a second antibody, and an immunochromatographic detection method for a target antigen in a biological sample, comprising forming multiple bonds with a quantum dot having a second binding material. In addition, the present disclosure has the effect of remarkably amplifying the detection intensity and significantly improving the detection sensitivity without a separate washing step, and thus enables the detection and diagnosis of physiological materials in a biological sample even in an actual product, and may be used to provide a product with excellent competitiveness in price.

Abstract: One aspect of the present disclosure relates to an immunochromatographic detection method for a target antigen in a biological sample, comprising the step of joining a linker having a first antibody and a quantum dot bead having a second antibody, with respect to the target antigen. By using the quantum dot beads and the linker, the method can successfully amplify detection strength and significantly increase detection sensitivity through a simple process without causing the loss of antigens participating in the detection when using only quantum dot beads. Furthermore, the present disclosure can significantly amplify detection strength without an additional washing step, thus enabling excellent detection and identification of a physiological substance in a biological sample, even in an actual product, and can be used to provide a product with a competitive price.

Abstract: Disclosed is a tin-based electroplating solution for forming solder bumps of a flip chip package. The tin-based electroplating solution includes tin methanesulfonate, silver methanesulfonate, methanesulfonic acid, a fluorinated surfactant, an aromatic polyoxyalkylene ether, and water. Also disclosed is a method for forming solder bumps by using the electroplating solution. The method includes (1) electroplating a silicon wafer having a protective layer through which an electrode pad is exposed and an under bump metallurgy (UBM) layer with a copper or copper/nickel plating solution to form copper or copper/nickel pillars on the under bump metallurgy layer and (2) electroplating the pillars with the tin-based electroplating solution to form solder bumps.

Abstract: Disclosed is a tin-based electroplating solution for forming solder bumps of a flip chip package. The tin-based electroplating solution includes tin methanesulfonate, silver methanesulfonate, methanesulfonic acid, a fluorinated surfactant, an aromatic polyoxyalkylene ether, and water. Also disclosed is a method for forming solder bumps by using the electroplating solution. The method includes (1) electroplating a silicon wafer having a protective layer through which an electrode pad is exposed and an under bump metallurgy (UBM) layer with a copper or copper/nickel plating solution to form copper or copper/nickel pillars on the under bump metallurgy layer and (2) electroplating the pillars with the tin-based electroplating solution to form solder bumps.