Patents by Inventor Heung Woo Jeong

Heung Woo Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230353944
    Abstract: A waterproof microspeaker includes: a frame; a magnetic circuit provided below the frame and including a yoke, inner and outer magnets, and a top plate; a voice coil located between the magnets and configured to vibrate by a magnetic field of the magnetic circuit and mutual electromagnetic force when an electric signal is applied; and a diaphragm housing provided above the frame. The diaphragm housing includes: a sidewall portion provided above the frame and having a predetermined height; an edge dome portion protruding upwardly or downwardly along an inner circumference of the sidewall portion; and a diaphragm provided inside the edge dome, allowing an upper end of the voice coil to be fixed thereto, and configured to generate sound by vibration of the voice coil. The diaphragm includes a polymeric material including metal or plastic and is inserted into an inner circumferential portion of the edge dome portion.
    Type: Application
    Filed: April 20, 2023
    Publication date: November 2, 2023
    Inventors: Gang Tae Kim, Heung Woo Jeong, Hyun Woo Jeong, Hyeon Sik You
  • Patent number: 10419848
    Abstract: The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, a sound absorber arranged in the resonance space and defining a space, and porous materials filled in the space defined by the sound absorber.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: September 17, 2019
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Kyu Dong Choi, Seul Ki Nam, Heung Woo Jeong
  • Publication number: 20170359649
    Abstract: The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, a sound absorber arranged in the resonance space and defining a space, and porous materials filled in the space defined by the sound absorber.
    Type: Application
    Filed: June 8, 2017
    Publication date: December 14, 2017
    Inventors: Kyu Dong Choi, Seul Ki Nam, Heung Woo Jeong