Abstract: A deposition apparatus to deposit deposition particles on an object includes a first vacuum chamber to accommodate the object, a target provided in the first vacuum chamber to discharge the deposition particles to the object, a sputter source to support the target and to cause the target to discharge the deposition particles, a second vacuum chamber to communicate with the first vacuum chamber, and an ion beam source coupled to the second vacuum chamber to discharge an ion beam to the object. Thus, the deposition apparatus reduces consumption of the target and improves adhesion of the object and the deposition layer.