Patents by Inventor Hewen SHEN

Hewen SHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11304296
    Abstract: A substrate is provided. The substrate includes a bottom plate and at least one bonding portion disposed on the bottom plate, where each bonding portion takes a shape that is a part of an Archimedean spiral. An electronic device, a bonding structure, and a bonding method for the bonding structure are further provided.
    Type: Grant
    Filed: April 28, 2018
    Date of Patent: April 12, 2022
    Assignee: SHENZHEN ROYOLE TECHNOLOGIES CO., LTD.
    Inventors: Zhigao Xu, Hewen Shen
  • Publication number: 20220039277
    Abstract: A foldable display device and a foldable terminal are provided. The foldable display device comprises a flexible screen, a folding mechanism, a bendable flattening sheet, and two sets of sliding mechanisms. The folding mechanism, the flattening sheet and the flexible screen are laminated in sequence, and are fixedly connected to each other at a middle folding position, so as to avoid arching of the flexible screen. The two sets of sliding mechanisms each include a first spring, a first sliding member, a second spring, and a second sliding member connected in sequence; two ends of the flattening sheet are fixed to the first sliding members of the two sets of sliding mechanisms respectively, and two ends of the flexible screen are fixed to the second sliding members of the two sets of sliding mechanisms respectively.
    Type: Application
    Filed: July 28, 2021
    Publication date: February 3, 2022
    Inventor: Hewen Shen
  • Publication number: 20210076494
    Abstract: A substrate is provided. The substrate includes a bottom plate and at least one bonding portion disposed on the bottom plate, where each bonding portion takes a shape that is a part of an Archimedean spiral. An electronic device, a bonding structure, and a bonding method for the bonding structure are further provided.
    Type: Application
    Filed: April 28, 2018
    Publication date: March 11, 2021
    Inventors: Zhigao XU, Hewen SHEN