Abstract: A bio-inspired artificial intelligence operational system (AIOps) and method are disclosed. The AIOps system includes an AI module with low-level containers configured to gather, identify extract, translate and transform incoming data, a redesigner module with high-level containers configured to enrich the low-level data from the AI module data with knowledge integration from past transactions to deliver an AI output in the form of, for example, a recommendation, a prediction, an abnormality detection, and event categorization, and a temperature module with temperature containers configured to efficiently detect and handle outages and component faults of the AI and redesigner modules. The AIOp system can be employed to generate a high performance and reliable Fast Data system.

Abstract: An artificial intelligence (AI) system or software AI platform that is capable of performing video analytics and image processing. The system, which may be referred to as a video robot system, may be employed to view video feeds to detect events and objects without humans. The video robot system enables real-time monitoring of video feeds with high accuracy and low false detection (errors). The system is able to detect and discern complex action sequences that will lead to greater granular process automation and response reactions.

Abstract: A system and method for AI reverse chatbots with an enhanced pro-active initiative configured to provide supervision catering to personnel training and critical operation monitoring to ensure safety and security compliance. The reverse chatbots are configured to utilize sensory devices to track a user during a job. The job includes performing a series of actions and tracking of the user includes processing of sensory data to identify at least one incorrect action. The AI reverse chatbots are also configured to provide feedback to the user. Through real-time monitoring and feedback to avoid incorrect completion of the job, the reverse chatbots are configured to provide interactive supervision of the user.

Abstract: A system and method for an AI risk summarizer are disclosed. Risk assessment includes receiving instream data from different data sources and processing the instream data to extract informative features. Risk analytics is computed using extracted informative features and results may be generated as reports to include multimedia reports. Overall, the system and method support multimedia data processing for a more meaningful and accurate risk assessment.

Abstract: An AI enhanced privacy data lake is disclosed. A processing module processes instream transactions to identify privacy data, such as personally identifiable information (PII), and encrypts it using tokenization with format preserving encryption (FPE). The processed instream transactions are stored in the data lake as data fragments with tagging to enable easy consolidation to provide a complete 360° view of customers while complying with privacy data regulations.

Abstract: A method is disclosed for forming a capacitor on a semiconductor wafer. A first electrically conductive layer is applied atop the wafer and engages exposed active areas. A first dielectric layer is next applied. The first dielectric and conductive layers are then patterned to define an outline for the lower capacitor plate. A second dielectric layer, having an etch rate which is slower than the first, is then applied and planarized or otherwise etched down to the first dielectric layer. The first dielectric layer is then etched down to the first conductive layer to produce upwardly projecting walls of second dielectric material surrounding the lower capacitor plate outline. A second electrically conductive layer is then applied. It is then anisotropically etched to provide a first electrically conductive wall extending upwardly from the first conductive layer. A third dielectric layer is then applied.

Abstract: A method is disclosed for forming a capacitor on a semiconductor wafer which utilizes top and back sides of a capacitor node for capacitance maximization. First and second dielectric layers, having different etch rates, are applied atop the wafer, and a contact opening is etched therethrough. Poly is applied and etched to begin formation of one node of the capacitor. A layer of oxide is then formed atop the poly capacitor node. The first dielectric layer is then etched, leaving a projecting or floating capacitor node which is surrounded by the second dielectric material and oxide formed thereatop. The surrounding material is then etched, the capacitor dielectric applied, and the poly of the second capacitor nod applied and selectively etched.