Abstract: A substrate heating device includes: a heating plate for heating a first substrate mounted thereon; a cooling plate installed adjacent to the heating plate and for mounting a second substrate, before being heated, introduced to the cooling plate, and cool the first substrate; a substrate transfer mechanism for transferring the first or second substrate between the cooling plate and the heating plate; a heat shielding plate installed across a region below the heating plate and the cooling plate; a cooling mechanism for cooling the heat shielding plate; and a low oxygen atmosphere forming part for setting an atmosphere in which the first substrate is heated to a low oxygen atmosphere, wherein the substrate transfer mechanism includes a substrate holding part for holding the first or second substrate and a moving mechanism installed below the heat shielding plate to move the substrate holding part in the front-back direction.

Abstract: A substrate heating device includes: a heating plate for heating a first substrate mounted thereon; a cooling plate installed adjacent to the heating plate and for mounting a second substrate, before being heated, introduced to the cooling plate, and cool the first substrate; a substrate transfer mechanism for transferring the first or second substrate between the cooling plate and the heating plate; a heat shielding plate installed across a region below the heating plate and the cooling plate; a cooling mechanism for cooling the heat shielding plate; and a low oxygen atmosphere forming part for setting an atmosphere in which the first substrate is heated to a low oxygen atmosphere, wherein the substrate transfer mechanism includes a substrate holding part for holding the first or second substrate and a moving mechanism installed below the heat shielding plate to move the substrate holding part in the front-back direction.