Abstract: According to one embodiment, there is provided a semiconductor device including a package. The package includes a first terminal, a second terminal, a semiconductor chip, and a sealing member. The first terminal is compatible with a first bus standard. The second terminal is compatible with a second bus standard. In the semiconductor chip, the first terminal and the second terminal are electrically connected. The sealing member covers one end of the first terminal and one end of the second terminal, exposes an other end of the first terminal and an other end of the second terminal, and covers the semiconductor chip.

Abstract: A USB device has a USB connector, a first housing comprising an opening through which the USB connector can be moved outward and inward, a second housing configured to be coupled to the first housing so that whether or not to cover the opening can be freely changed, and a movement controller configured to perform control for moving the USB connector outward and inward through the opening, in synchronization with whether or not the second housing covers the opening. The movement controller comprises a biasing force applying unit configured to apply a first biasing force in a direction in which the USB connector is accommodated in the first housing and to apply a second biasing force in a direction in which the second housing covers the opening, when the USB connector is pushed out from the opening.