Patents by Inventor Hideadki Seto

Hideadki Seto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer chucking apparatus for spin processor
    Publication number: 20060180176
    Abstract: A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. A first group of retractable tips extend to hold the wafer during a first portion of the cleaning period. A second group of retractable tips extend to hold the wafer during a second portion of the cleaning period. Residues left between the tips and the wafer edge areas during the first portion of the cleaning period are removed during the second portion. The change from the first group of tips to the second group of tips occurs while the wafer is rotating.
    Type: Application
    Filed: April 11, 2006
    Publication date: August 17, 2006
    Inventors: Kyoko Kuroki, Hideadki Seto