Patents by Inventor Hideaki Abe

Hideaki Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12232262
    Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.
    Type: Grant
    Filed: January 9, 2024
    Date of Patent: February 18, 2025
    Assignee: Japan Display Inc.
    Inventor: Hideaki Abe
  • Patent number: 12183865
    Abstract: An LED module includes a first protrusion and a second protrusion adjacent to the first protrusion arranged on an insulating surface, a first electrode arranged on the first protrusion, and a second electrode arranged on the second protrusion, and an LED chip arranged on upper sides of the first protrusion and the second protrusion. The LED chip is connected to the first electrode and the second electrode via conductive members, and the first protrusion and the second protrusion are insulative and have a height of 1 ?m to 50 ?m.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: December 31, 2024
    Assignee: JAPAN DISPLAY INC.
    Inventor: Hideaki Abe
  • Publication number: 20240419224
    Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.
    Type: Application
    Filed: August 29, 2024
    Publication date: December 19, 2024
    Applicant: Japan Display Inc.
    Inventors: Keisuke ASADA, Hideaki ABE, Kota UOGISHI, Kazuyuki YAMADA
  • Publication number: 20240360967
    Abstract: A filter apparatus is a filter apparatus that transmits light emitted by a light source (a lighting apparatus), and the filter apparatus includes a simulated object that receives the light emitted by the light source, a driving device that mechanically moves the simulated object, and a first lens that transmits the light emitted by the light source and having passed through the simulated object. The filter apparatus projects, onto an illumination surface, a projection image of fluctuation of light and shadow formed by the light emitted by the light source and having passed through the simulated object and the first lens.
    Type: Application
    Filed: July 26, 2022
    Publication date: October 31, 2024
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Hideaki ABE, Kenji OKADA
  • Patent number: 12105566
    Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.
    Type: Grant
    Filed: July 5, 2023
    Date of Patent: October 1, 2024
    Assignee: Japan Display Inc.
    Inventors: Keisuke Asada, Hideaki Abe, Kota Uogishi, Kazuyuki Yamada
  • Publication number: 20240284595
    Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.
    Type: Application
    Filed: May 1, 2024
    Publication date: August 22, 2024
    Inventors: Youhei IWAI, Hideaki ABE
  • Publication number: 20240213850
    Abstract: A gear mechanism has an input shaft and transmits rotation of the input shaft. A generator generates electric power in response to the rotation transmitted by the gear mechanism. A pendulum is connected to the input shaft of the gear mechanism. A frame is provided at a fixed position relative to the gear mechanism and the generator. A elastic body supports the pendulum with respect to the frame so as to generate a restoring force to a predetermined position. The pendulum swings about the input shaft of the gear mechanism in response to shaking of a whole of an electromechanical apparatus, or in response to the restoring force of the elastic body, and the generator generates the electric power in response to swinging of the pendulum.
    Type: Application
    Filed: March 17, 2021
    Publication date: June 27, 2024
    Inventor: Hideaki ABE
  • Patent number: 12010797
    Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.
    Type: Grant
    Filed: August 3, 2023
    Date of Patent: June 11, 2024
    Assignee: Japan Display Inc.
    Inventors: Youhei Iwai, Hideaki Abe
  • Publication number: 20240164020
    Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 16, 2024
    Inventor: Hideaki ABE
  • Patent number: 11910528
    Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: February 20, 2024
    Assignee: Japan Display Inc.
    Inventor: Hideaki Abe
  • Publication number: 20230380063
    Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.
    Type: Application
    Filed: August 3, 2023
    Publication date: November 23, 2023
    Inventors: Youhei IWAI, Hideaki ABE
  • Patent number: 11815955
    Abstract: According to one embodiment, a display device including a display panel including a mount side curved to correspond to the curved shape of a display surface, a flat circuit board, and a first flexible wiring board mounted on the display panel in a first end side while being connected to the circuit board in a second end side, wherein the first flexible wiring board includes a first base member including a first surface and a second surface, a first line positioned in the first surface side, and a first protection layer covering the first line, and includes a first bending part to be bent between a first bending boundary and a second bending boundary, the second bending boundary is inclined with respect to the first bending boundary, and the first base member includes a first groove positioned in the first bending part and formed in the second surface.
    Type: Grant
    Filed: October 15, 2021
    Date of Patent: November 14, 2023
    Assignee: Japan Display Inc.
    Inventors: Hideaki Abe, Kazuyuki Yamada, Keisuke Asada, Kota Uogishi
  • Publication number: 20230350470
    Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.
    Type: Application
    Filed: July 5, 2023
    Publication date: November 2, 2023
    Applicant: Japan Display Inc.
    Inventors: Keisuke ASADA, Hideaki ABE, Kota UOGISHI, Kazuyuki YAMADA
  • Patent number: 11765829
    Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: September 19, 2023
    Assignee: Japan Display Inc.
    Inventors: Youhei Iwai, Hideaki Abe
  • Patent number: 11740668
    Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: August 29, 2023
    Assignee: Japan Display Inc.
    Inventors: Keisuke Asada, Hideaki Abe, Kota Uogishi, Kazuyuki Yamada
  • Patent number: 11668984
    Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: June 6, 2023
    Assignee: Japan Display Inc.
    Inventors: Hideaki Abe, Yasuhito Aruga, Hiroyuki Onodera, Hiroki Kato, Yasushi Nakano, Hitoshi Kawaguchi, Keisuke Asada
  • Patent number: 11665822
    Abstract: An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.
    Type: Grant
    Filed: January 4, 2022
    Date of Patent: May 30, 2023
    Assignee: Japan Display Inc.
    Inventors: Youhei Iwai, Hideaki Abe
  • Patent number: 11497232
    Abstract: [Problem to be Solved] The present invention provides a method for producing fried noodles having a reduced sodium content and excellent noodle making properties, texture, and flavor. [Solution] Fresh noodles having excellent noodle making properties, texture, and flavor can be produced not by adding salt but by adding 1 to 3% by weight of potassium lactate relative to a main raw material powder such as wheat flour. Further, fried noodles having a reduced sodium content and excellent texture and flavor can be produced by steaming the fresh noodles and fry drying.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: November 15, 2022
    Assignee: NISSIN FOODS HOLDINGS CO., LTD.
    Inventors: Hideaki Abe, Toshio Yoshinuma
  • Patent number: 11497231
    Abstract: The present invention provides a method for producing non-fried noodles having a reduced sodium content and excellent noodle making properties, texture, and flavor. Fresh noodles having excellent noodle making properties, texture, and flavor can be produced by adding 1 to 3% by weight of potassium lactate relative to a main raw material powder such as wheat flour even without adding salt. Further, non-fried noodles having a reduced sodium content and excellent texture and flavor can be produced by steaming the fresh noodles and then drying the noodles by hot air. Moreover, after drying, the non-fried noodles dried by hot air to have a moisture of 7 to 14% by weight is further subjected to a heating process with high-temperature hot air, a gas mixture of high-temperature hot air and water vapor, or superheated steam at 120 to 200° C. until the moisture of the non-fried noodles is reduced to 3 to 6% by weight, which can consequently reduce a harsh taste derived from potassium lactate.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: November 15, 2022
    Assignee: NISSIN FOODS HOLDINGS CO., LTD.
    Inventors: Hideaki Abe, Mitsuru Tanaka
  • Publication number: 20220262665
    Abstract: An element transfer device includes an elastic sheet including a through hole and a pickup portion including a shaft portion, a first head portion at a first end of the shaft portion, and a second head portion at a second end of the shaft portion. The first head portion includes a pickup surface for adhering an element. The shaft portion is inserted into the through hole. The first head portion and the second head portion sandwich the elastic sheet. An outer diameter of the first head portion and an outer diameter of the second head portion are larger than an opening diameter of the through hole.
    Type: Application
    Filed: February 10, 2022
    Publication date: August 18, 2022
    Applicant: Japan Display Inc.
    Inventor: Hideaki ABE