Patents by Inventor Hideaki Abe
Hideaki Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12232262Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.Type: GrantFiled: January 9, 2024Date of Patent: February 18, 2025Assignee: Japan Display Inc.Inventor: Hideaki Abe
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Patent number: 12183865Abstract: An LED module includes a first protrusion and a second protrusion adjacent to the first protrusion arranged on an insulating surface, a first electrode arranged on the first protrusion, and a second electrode arranged on the second protrusion, and an LED chip arranged on upper sides of the first protrusion and the second protrusion. The LED chip is connected to the first electrode and the second electrode via conductive members, and the first protrusion and the second protrusion are insulative and have a height of 1 ?m to 50 ?m.Type: GrantFiled: January 7, 2022Date of Patent: December 31, 2024Assignee: JAPAN DISPLAY INC.Inventor: Hideaki Abe
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Publication number: 20240419224Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.Type: ApplicationFiled: August 29, 2024Publication date: December 19, 2024Applicant: Japan Display Inc.Inventors: Keisuke ASADA, Hideaki ABE, Kota UOGISHI, Kazuyuki YAMADA
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Publication number: 20240360967Abstract: A filter apparatus is a filter apparatus that transmits light emitted by a light source (a lighting apparatus), and the filter apparatus includes a simulated object that receives the light emitted by the light source, a driving device that mechanically moves the simulated object, and a first lens that transmits the light emitted by the light source and having passed through the simulated object. The filter apparatus projects, onto an illumination surface, a projection image of fluctuation of light and shadow formed by the light emitted by the light source and having passed through the simulated object and the first lens.Type: ApplicationFiled: July 26, 2022Publication date: October 31, 2024Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Hideaki ABE, Kenji OKADA
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Patent number: 12105566Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.Type: GrantFiled: July 5, 2023Date of Patent: October 1, 2024Assignee: Japan Display Inc.Inventors: Keisuke Asada, Hideaki Abe, Kota Uogishi, Kazuyuki Yamada
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Publication number: 20240284595Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.Type: ApplicationFiled: May 1, 2024Publication date: August 22, 2024Inventors: Youhei IWAI, Hideaki ABE
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Publication number: 20240213850Abstract: A gear mechanism has an input shaft and transmits rotation of the input shaft. A generator generates electric power in response to the rotation transmitted by the gear mechanism. A pendulum is connected to the input shaft of the gear mechanism. A frame is provided at a fixed position relative to the gear mechanism and the generator. A elastic body supports the pendulum with respect to the frame so as to generate a restoring force to a predetermined position. The pendulum swings about the input shaft of the gear mechanism in response to shaking of a whole of an electromechanical apparatus, or in response to the restoring force of the elastic body, and the generator generates the electric power in response to swinging of the pendulum.Type: ApplicationFiled: March 17, 2021Publication date: June 27, 2024Inventor: Hideaki ABE
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Patent number: 12010797Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.Type: GrantFiled: August 3, 2023Date of Patent: June 11, 2024Assignee: Japan Display Inc.Inventors: Youhei Iwai, Hideaki Abe
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Publication number: 20240164020Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.Type: ApplicationFiled: January 9, 2024Publication date: May 16, 2024Inventor: Hideaki ABE
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Patent number: 11910528Abstract: According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.Type: GrantFiled: January 18, 2022Date of Patent: February 20, 2024Assignee: Japan Display Inc.Inventor: Hideaki Abe
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Publication number: 20230380063Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.Type: ApplicationFiled: August 3, 2023Publication date: November 23, 2023Inventors: Youhei IWAI, Hideaki ABE
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Patent number: 11815955Abstract: According to one embodiment, a display device including a display panel including a mount side curved to correspond to the curved shape of a display surface, a flat circuit board, and a first flexible wiring board mounted on the display panel in a first end side while being connected to the circuit board in a second end side, wherein the first flexible wiring board includes a first base member including a first surface and a second surface, a first line positioned in the first surface side, and a first protection layer covering the first line, and includes a first bending part to be bent between a first bending boundary and a second bending boundary, the second bending boundary is inclined with respect to the first bending boundary, and the first base member includes a first groove positioned in the first bending part and formed in the second surface.Type: GrantFiled: October 15, 2021Date of Patent: November 14, 2023Assignee: Japan Display Inc.Inventors: Hideaki Abe, Kazuyuki Yamada, Keisuke Asada, Kota Uogishi
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Publication number: 20230350470Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.Type: ApplicationFiled: July 5, 2023Publication date: November 2, 2023Applicant: Japan Display Inc.Inventors: Keisuke ASADA, Hideaki ABE, Kota UOGISHI, Kazuyuki YAMADA
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Patent number: 11765829Abstract: To mitigate a bending stress in the flexible wiring substrate in a structure, a display panel, to which the flexible wiring substrate connects, is curved along a first direction, and the flexible wiring is bent back to the rear of the display panel. The flexible wiring substrate connects with the display panel at a first region and at a second region; the flexible wiring substrate connects with the wiring substrate at a third region and at a fourth region. The flexible wiring substrate has a narrowest width in the first direction at an intermediate region between the display panel and the wiring substrate. A first wiring group in the flexible wiring substrate connects the first region with the third region or the fourth region, a second wiring group in the flexible wiring substrate connects the second region with another one of the third region or the fourth region.Type: GrantFiled: July 2, 2021Date of Patent: September 19, 2023Assignee: Japan Display Inc.Inventors: Youhei Iwai, Hideaki Abe
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Patent number: 11740668Abstract: An electronic device includes a substrate having a first surface and a second surface opposite the first surface and including an input terminal part on the first surface, a wiring substrate having a flexibility connected to the input terminal part, and an electronic component on the second surface of the substrate. The wiring substrate has an opening through the wiring substrate, and the opening overlaps with the electronic component when the wiring substrate is bent to a side of the second surface of the substrate.Type: GrantFiled: April 26, 2022Date of Patent: August 29, 2023Assignee: Japan Display Inc.Inventors: Keisuke Asada, Hideaki Abe, Kota Uogishi, Kazuyuki Yamada
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Patent number: 11668984Abstract: A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.Type: GrantFiled: April 7, 2022Date of Patent: June 6, 2023Assignee: Japan Display Inc.Inventors: Hideaki Abe, Yasuhito Aruga, Hiroyuki Onodera, Hiroki Kato, Yasushi Nakano, Hitoshi Kawaguchi, Keisuke Asada
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Patent number: 11665822Abstract: An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.Type: GrantFiled: January 4, 2022Date of Patent: May 30, 2023Assignee: Japan Display Inc.Inventors: Youhei Iwai, Hideaki Abe
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Patent number: 11497232Abstract: [Problem to be Solved] The present invention provides a method for producing fried noodles having a reduced sodium content and excellent noodle making properties, texture, and flavor. [Solution] Fresh noodles having excellent noodle making properties, texture, and flavor can be produced not by adding salt but by adding 1 to 3% by weight of potassium lactate relative to a main raw material powder such as wheat flour. Further, fried noodles having a reduced sodium content and excellent texture and flavor can be produced by steaming the fresh noodles and fry drying.Type: GrantFiled: August 29, 2017Date of Patent: November 15, 2022Assignee: NISSIN FOODS HOLDINGS CO., LTD.Inventors: Hideaki Abe, Toshio Yoshinuma
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Patent number: 11497231Abstract: The present invention provides a method for producing non-fried noodles having a reduced sodium content and excellent noodle making properties, texture, and flavor. Fresh noodles having excellent noodle making properties, texture, and flavor can be produced by adding 1 to 3% by weight of potassium lactate relative to a main raw material powder such as wheat flour even without adding salt. Further, non-fried noodles having a reduced sodium content and excellent texture and flavor can be produced by steaming the fresh noodles and then drying the noodles by hot air. Moreover, after drying, the non-fried noodles dried by hot air to have a moisture of 7 to 14% by weight is further subjected to a heating process with high-temperature hot air, a gas mixture of high-temperature hot air and water vapor, or superheated steam at 120 to 200° C. until the moisture of the non-fried noodles is reduced to 3 to 6% by weight, which can consequently reduce a harsh taste derived from potassium lactate.Type: GrantFiled: August 29, 2017Date of Patent: November 15, 2022Assignee: NISSIN FOODS HOLDINGS CO., LTD.Inventors: Hideaki Abe, Mitsuru Tanaka
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Publication number: 20220262665Abstract: An element transfer device includes an elastic sheet including a through hole and a pickup portion including a shaft portion, a first head portion at a first end of the shaft portion, and a second head portion at a second end of the shaft portion. The first head portion includes a pickup surface for adhering an element. The shaft portion is inserted into the through hole. The first head portion and the second head portion sandwich the elastic sheet. An outer diameter of the first head portion and an outer diameter of the second head portion are larger than an opening diameter of the through hole.Type: ApplicationFiled: February 10, 2022Publication date: August 18, 2022Applicant: Japan Display Inc.Inventor: Hideaki ABE