Patents by Inventor Hideaki Gotou

Hideaki Gotou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6054181
    Abstract: A method of subjecting a plurality of wafers to coating and beating treatments where a first boat is placed on a stage arranged in an interface section. The first boat is capable of containing the wafers stacked at intervals in a vertical direction. The stage is capable of moving in a horizontal direction, and has a plurality of positions for respectively placing a plurality of boats. The wafers are conveyed from a supply section to a coating section, and are subjected to a coating treatment one by one. The wafers, which have undergone the coating treatment, are conveyed to the interface section. The wafers, which have undergone the coating treatment, are loaded into the first boat placed on the stage, in the interface section. The first boat containing the wafers, which have undergone the coating treatment, is located at a transfer position by moving the stage. The first boat, located at a transfer position by moving the stage.
    Type: Grant
    Filed: August 5, 1996
    Date of Patent: April 25, 2000
    Assignees: Tokyo Electron Limited, Tokyo Electron Kyushu Limited
    Inventors: Mitsuhiro Nanbu, Naruaki Iida, Hideaki Gotou, Masanori Tateyama, Yuji Yoshimoto, Tomoko Ishimoto, Hidetami Yaegashi, Yasunori Kawakami, Takahide Fukuda, Akihiro Fujimoto, Takashi Takekuma, Hiroyuki Matsukawa
  • Patent number: 5725664
    Abstract: An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space.
    Type: Grant
    Filed: August 5, 1996
    Date of Patent: March 10, 1998
    Assignees: Tokyo Electron Limited, Tokyo Electron Kyushu Limited
    Inventors: Mitsuhiro Nanbu, Naruaki Iida, Hideaki Gotou, Masanori Tateyama, Yuji Yoshimoto, Tomoko Ishimoto, Hidetami Yaegashi, Yasunori Kawakami, Takahide Fukuda, Akihiro Fujimoto, Takashi Takekuma, Hiroyuki Matsukawa
  • Patent number: 5565034
    Abstract: A substrate processing apparatus according to this invention includes an interface section having a first transfer member for transferring an object from a coating process section for applying a process solution to the object in accordance with a single sheet process to an object holding member, and a moving member for detachably supplying a plurality of object holding member and simultaneously moving the plurality of object holding member, and a heat-treatment section having a second transfer member for transferring the object placed on the object holding member to a heat-treatment section for heat-treating the plurality of objects, which have undergone the coating process, in accordance with a batch process.
    Type: Grant
    Filed: October 28, 1994
    Date of Patent: October 15, 1996
    Assignees: Tokyo Electron Limited, Tokyo Electron Kyushu Limited
    Inventors: Mitsuhiro Nanbu, Naruaki Iida, Hideaki Gotou, Masanori Tateyama, Yuji Yoshimoto, Tomoko Ishimoto, Hidetami Yaegashi, Yasunori Kawakami, Takahide Fukuda, Akihiro Fujimoto, Takashi Takekuma, Hiroyuki Matsukawa