Abstract: A semiconductor chip includes a first electrode connected to a gate of a power device, a second electrode connected to an emitter or a source of the power device, a third electrode, and a gate protection element. The gate protection element includes a first node and a second node, and a plurality of stages of p-n junctions formed between the first node and the second node. When one of the first electrode and the second electrode is a target electrode and the other is a non-target electrode, and the first node is connected to the third electrode and the second node is connected to the target electrode. Then, the first electrode, the second electrode, the third electrode and the gate protection element are formed in the same semiconductor chip.

Abstract: The present disclosure provides a MEMS device having a movable portion. The MEMS device includes: a substrate; a recess, disposed in the substrate; the movable portion, hollowly supported in the recess; and a bump stop, hollowly supported in the recess and configured to restrict a movement of the movable portion by contacting the movable portion. The bump stop includes: a protruding portion, configured to contact the movable portion; and a shock absorbing portion, disposed between the protruding portion and the substrate and configured to absorb at least a part of an impact force applied to the protruding portion by elastic deformation.

Abstract: There is provided an on-board-device bracket capable of appropriately mounting a front portion of an imaging means with respect to a windshield. An on-board-device bracket 10 is formed by a bracket body portion 11 and a front portion 16 connected to a front part of a center portion of the bracket body portion 11. Slits 17 along the front portion 16 are formed between the front portion 16 and the bracket body portion 11. The front portion 16 includes, at the front end thereof, a front bonding portion. The front portion 16 is bent by the slits 17 individually from the bracket body portion 11 and displaced with respect to a windshield 1.

Abstract: Hafnium carbide powder for plasma electrodes is represented by a chemical formula HfCx (where x=0.5 to 1.0). The content of carbon particles contained as impurities in the hafnium carbide powder is less than or equal to 0.03% by mass. The hafnium carbide powder preferably has an average particle size of 0.5 to 2 ?m. To produce the hafnium carbide powder, a pellet made from mixed powder of hafnium oxide and carbon is first placed in a second crucible made of silicon carbide. Then, the hafnium carbide powder is formed by heating the second crucible at 1800 to 2000° C. with the second crucible arranged in a first crucible made of carbon.

Abstract: A semiconductor chip includes a first electrode connected to a gate of a power device, a second electrode connected to an emitter or a source of the power device, a third electrode, and a gate protection element. The gate protection element includes a first node and a second node, and a plurality of stages of p-n junctions formed between the first node and the second node. When one of the first electrode and the second electrode is a target electrode and the other is a non-target electrode, and the first node is connected to the third electrode and the second node is connected to the target electrode. Then, the first electrode, the second electrode, the third electrode and the gate protection element are formed in the same semiconductor chip.

Abstract: The present invention provides a display system comprising: first and second information processing devices; first and second display devices configured to switch between a first display mode, in which a first image output from the first information processing device is displayed across the first and second display devices, and a second display mode, in which a second image output from the second information processing device is displayed across the first and second display devices; a detector configured to detect whether a pointing position is positioned on a switch area arranged in at least one of the first and second display devices; and a display switcher configured to, when the detector detects the pointing position on the switch area in the first display mode, switch a display mode from the first display mode to the second display mode.

Abstract: There is provided an on-board-device bracket capable of appropriately mounting a front portion of an imaging means with respect to a windshield. An on-board-device bracket 10 is formed by a bracket body portion 11 and a front portion 16 connected to a front part of a center portion of the bracket body portion 11. Slits 17 along the front portion 16 are formed between the front portion 16 and the bracket body portion 11. The front portion 16 includes, at the front end thereof, a front bonding portion. The front portion 16 is bent by the slits 17 individually from the bracket body portion 11 and displaced with respect to a windshield 1.

Abstract: A pattern inspection apparatus according to an aspect described herein includes: a stage on which an object to be inspected is capable to be mounted, a multibeam column that irradiates the object to be inspected with multi-primary electron beams, and a multi-detector including a first detection pixel that receives irradiation of a first secondary electron beam emitted after a first beam scanning region of the object to be inspected is irradiated with a first primary electron beam of the multi-primary electron beams and a second detection pixel that receives irradiation of a second secondary electron beam emitted after a second beam scanning region adjacent to the first beam scanning region of the object to be inspected and overlapping with the first beam scanning region is irradiated with a second primary electron beam adjacent to the first primary electron beam of the multi-primary electron beams; a comparison unit that obtains a difference in beam intensity between the first primary electron beam and the se

Abstract: The present invention provides a display system configured to control a plurality of display devices by combining a plurality of information processing devices and the display devices, even if the display system includes a display device incapable of communicating a switch signal with all of the information processing devices.

Abstract: There is provided an inspection method including acquiring an inspection image by irradiating a sample with a plurality of electron beams and by simultaneously scanning the sample by the electron beams, performing first correction of a reference image corresponding to the inspection image or second correction of the inspection image based on a plurality of distortions of each of the electron beams and on a position scanned by each of the electron beams in the inspection image, and performing first comparison of the reference image subjected to the first correction with the inspection image or second comparison of the reference image with the inspection image subjected to the second correction.

Abstract: According to one embodiment, an inspection device includes: an image generation device configured to generate a second image corresponding to a first image; and a defect detection device configured to estimate a nonlinear shift based on a plurality of partial region sets, each of the partial region sets including a first partial region in the first image and a second partial region in the second image corresponding to the first partial region, and detect a defect in the second image from the first image.

Abstract: Provided is a pattern inspection method including: irradiating a substrate with an electron beam, a pattern being formed on the substrate; acquiring an inspection image as a secondary electron image of the pattern; setting a pixel value equal to or less than a first threshold value minus a half of a predetermined detection width of the inspection image and a pixel value equal to or more than the first threshold value plus a half of the predetermined detection width of the inspection image to unprocessed; acquiring a difference image between the inspection image having the pixel value having less than the first threshold value minus the half of the predetermined detection width and the pixel value having more of the first threshold value plus the half of the predetermined detection width being set to unprocessed and a reference image of the inspection image; and performing inspection on the basis of the difference image.

Abstract: The present invention provides a display system configured to control a plurality of display devices by combining a plurality of information processing devices and the display devices, even if the display system includes a display device incapable of communicating a switch signal with all of the information processing devices.

Abstract: The present invention provides a display system comprising: first and second information processing devices; first and second display devices configured to switch between a first display mode, in which a first image output from the first information processing device is displayed across the first and second display devices, and a second display mode, in which a second image output from the second information processing device is displayed across the first and second display devices; a detector configured to detect whether a pointing position is positioned on a switch area arranged in at least one of the first and second display devices; and a display switcher configured to, when the detector detects the pointing position on the switch area in the first display mode, switch a display mode from the first display mode to the second display mode.

Abstract: A pattern inspection apparatus according to an aspect described herein includes: a stage on which an object to be inspected is capable to be mounted, a multibeam column that irradiates the object to be inspected with multi-primary electron beams, and a multi-detector including a first detection pixel that receives irradiation of a first secondary electron beam emitted after a first beam scanning region of the object to be inspected is irradiated with a first primary electron beam of the multi-primary electron beams and a second detection pixel that receives irradiation of a second secondary electron beam emitted after a second beam scanning region adjacent to the first beam scanning region of the object to be inspected and overlapping with the first beam scanning region is irradiated with a second primary electron beam adjacent to the first primary electron beam of the multi-primary electron beams; a comparison unit that obtains a difference in beam intensity between the first primary electron beam and the se

Abstract: According to one aspect of the present invention, a pattern inspection apparatus includes: a first sub-pixel interpolation processing circuitry configured to calculate a pixel value of a reference image corresponding to a position of each pixel of the inspection target image by performing an interpolation process using at least one pixel value of the reference image for each shift amount while variably and relatively shifting the inspection target image and the reference image by the unit of a sub-pixel using the reference image corresponding to the inspection target image; and an SSD calculation processing circuitry configured to calculate a sum of squared difference between each pixel value of the inspection target image and a corresponding pixel value of the reference image subjected to a filter process for the each shift amount.

Abstract: An electron beam inspection apparatus includes an acquisition processing circuitry to acquire surface material information presenting a surface material of the substrate and a value of an acceleration voltage of an electron beam; a sequence determination processing circuitry to determine a scan sequence of a plurality of stripe regions on the basis of the surface material of the substrate and the value of the acceleration voltage, the plurality of stripe regions obtained by virtually dividing an inspection region of the substrate in a stripe shape; a secondary electron image acquisition mechanism including a detector for detecting a secondary electron and configured to scan the plurality of stripe regions of the substrate according to a determined scan sequence and to acquire a secondary electron image of the substrate; and a comparison processing circuitry to compare the secondary electron image with a corresponding reference image.

Abstract: An electron beam inspection apparatus according to an embodiment includes a stage holding a substrate with a pattern; an electron beam column irradiating the substrate with multiple beams including a plurality of electron beams such that adjacent regions irradiated with the electron beams have an overlap portion therebetween; a first image storage unit storing a first inspection image acquired by irradiating a first inspection region of the substrate with the multiple beams; a second image storage unit storing a second inspection image acquired by irradiating a second inspection region of the substrate with the multiple beams; a correction coefficient storage unit storing a correction coefficient for correcting an image of the overlap portion; an image correction unit correcting an image of the overlap portion using the correction coefficient; and a comparison unit comparing the first inspection image with the second inspection image.

Abstract: An electron beam inspection apparatus according to an embodiment includes a stage holding a substrate with a pattern; an electron beam column irradiating the substrate with multiple beams including a plurality of electron beams such that adjacent regions irradiated with the electron beams have an overlap portion therebetween; a first image storage unit storing a first inspection image acquired by irradiating a first inspection region of the substrate with the multiple beams; a second image storage unit storing a second inspection image acquired by irradiating a second inspection region of the substrate with the multiple beams; a correction coefficient storage unit storing a correction coefficient for correcting an image of the overlap portion; an image correction unit correcting an image of the overlap portion using the correction coefficient; and a comparison unit comparing the first inspection image with the second inspection image.

Abstract: According to one aspect of the present invention, a pattern inspection apparatus includes an inspected image acquisition mechanism configured to acquire an inspected image of a figure pattern formed on an inspection target object, using an electron beam; a reference image generation processing circuit configured to generate a reference image corresponding to the inspected image; a contour data generation processing circuit configured to generate contour data defining a contour line of the figure pattern; a comparison processing circuit configured to compare the inspected image and the reference image and determine whether there is a defect based on a result of a comparison; and a defect selection processing circuit configured to select a defect within a range preset based on the contour line as a valid defect, from at least one defect determined to be a defect by the comparison, using the contour data.