Patents by Inventor Hideaki Hoki

Hideaki Hoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9352585
    Abstract: The object is to provide a thermal print head capable of improving printing quality on a medium. The Solution is to provide a base member 11 including a recess 113a, a heat storage region 2 formed in the recess 113a, a resistor layer 4 formed on the base member 11, and an electrode layer 3 formed on the base member 11 and electrically connected to the resistor layer 4. The resistor layer 4 includes a heating portion 41 spanned between two portions of the electrode layer 3 spaced from each other as viewed in a thickness direction Z of the base member 11. The heating portion 41 is located so as to overlap the recess 113a as viewed in the thickness direction Z. The base member 11 is made of a material having a thermal conductivity of 100 to 300 W/(m·K).
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: May 31, 2016
    Assignee: ROHM CO., LTD.
    Inventors: Hideaki Hoki, Tomohiko Horikawa, Shinobu Obata, Tomoharu Horio, Minoru Sakamoto
  • Publication number: 20160107452
    Abstract: The object is to provide a thermal print head capable of improving printing quality on a medium. The Solution is to provide a base member 11 including a recess 113a, a heat storage region 2 formed in the recess 113a, a resistor layer 4 formed on the base member 11, and an electrode layer 3 formed on the base member 11 and electrically connected to the resistor layer 4. The resistor layer 4 includes a heating portion 41 spanned between two portions of the electrode layer 3 spaced from each other as viewed in a thickness direction Z of the base member 11. The heating portion 41 is located so as to overlap the recess 113a as viewed in the thickness direction Z. The base member 11 is made of a material having a thermal conductivity of 100 to 300 W/(m·K).
    Type: Application
    Filed: December 28, 2015
    Publication date: April 21, 2016
    Inventors: Hideaki HOKI, Tomohiko HORIKAWA, Shinobu OBATA, Tomoharu HORIO, Minoru SAKAMOTO
  • Patent number: 9254650
    Abstract: A thermal printhead includes a substrate, a resistor layer formed on the substrate, an electrode layer formed on the substrate and electrically connected to the resistor layer, and an insulating layer. The electrode layer includes a first electrically conductive portion and a second electrically conductive portion spaced apart from each other. The resistor layer includes a heater portion that bridges the first electrically conductive portion and the second electrically conductive portion as viewed in the thickness direction of the substrate. The insulating layer includes a portion positioned between the electrode layer and the heater portion. This arrangement reduces formation of a eutectic region between the heater portion and the electrode layer.
    Type: Grant
    Filed: April 25, 2013
    Date of Patent: February 9, 2016
    Assignee: ROHM CO., LTD.
    Inventors: Tomohiko Horikawa, Hideaki Hoki
  • Patent number: 9248663
    Abstract: The object is to provide a thermal print head capable of improving printing quality on a medium. The Solution is to provide a base member 11 including a recess 113a, a heat storage region 2 formed in the recess 113a, a resistor layer 4 formed on the base member 11, and an electrode layer 3 formed on the base member 11 and electrically connected to the resistor layer 4. The resistor layer 4 includes a heating portion 41 spanned between two portions of the electrode layer 3 spaced from each other as viewed in a thickness direction Z of the base member 11. The heating portion 41 is located so as to overlap the recess 113a as viewed in the thickness direction Z. The base member 11 is made of a material having a thermal conductivity of 100 to 300 W/(m·K).
    Type: Grant
    Filed: August 27, 2013
    Date of Patent: February 2, 2016
    Assignee: ROHM CO., LTD.
    Inventors: Hideaki Hoki, Tomohiko Horikawa, Shinobu Obata, Tomoharu Horio, Minoru Sakamoto
  • Publication number: 20150251440
    Abstract: The object is to provide a thermal print head capable of improving printing quality on a medium. The Solution is to provide a base member 11 including a recess 113a, a heat storage region 2 formed in the recess 113a, a resistor layer 4 formed on the base member 11, and an electrode layer 3 formed on the base member 11 and electrically connected to the resistor layer 4. The resistor layer 4 includes a heating portion 41 spanned between two portions of the electrode layer 3 spaced from each other as viewed in a thickness direction Z of the base member 11. The heating portion 41 is located so as to overlap the recess 113a as viewed in the thickness direction Z. The base member 11 is made of a material having a thermal conductivity of 100 to 300 W/(m·K). Selected Figure is FIG. 6.
    Type: Application
    Filed: August 27, 2013
    Publication date: September 10, 2015
    Inventors: Hideaki Hoki, Tomohiko Horikawa, Shinobu Obata, Tomoharu Horio, Minoru Sakamoto
  • Patent number: 6558024
    Abstract: A method of making a casing of an image sensor is provided. The method includes the steps of preparing the casing, and applying a static electricity preventive to the casing. The casing is formed with a light passage configured to conduct light emitted from a light source. The static electricity preventive is applied to the inner surfaces of the casing defining the light passage. While the application of the preventive is performed, flashes formed at the light passage are removed.
    Type: Grant
    Filed: November 29, 2000
    Date of Patent: May 6, 2003
    Assignee: Rohm Co., Ltd.
    Inventors: Hideaki Hoki, Hiroaki Hayashi, Hiromi Ogata, Kunio Motoyama
  • Publication number: 20010002168
    Abstract: A method of making a casing of an image sensor is provided. The method includes the steps of preparing the casing, and applying a static electricity preventive to the casing. The casing is formed with a light passage configured to conduct light emitted from a light source. The static electricity preventive is applied to the inner surfaces of the casing defining the light passage. While the application of the preventive is performed, flashes formed at the light passage are removed.
    Type: Application
    Filed: November 29, 2000
    Publication date: May 31, 2001
    Inventors: Hideaki Hoki, Hiroaki Hayashi, Hiromi Ogata, Kunio Motoyama
  • Patent number: 5847744
    Abstract: A thin-film type thermal print head has a resistor layer formed over an insulative substrate, a conductor layer having a specified planar pattern overlapping the resistor layer, a portion of the resistor layer serving as a heat-emitting part which is not covered by the conductor layer, and a protective layer formed over the heat-emitting part and at least a portion of the conductor layer adjacent to the heat-emitting part. The protective layer may be formed as a conductive layer with resistance greater than that of the heat-emitting part such that static electricity which may be generated by the friction with printing paper can quickly escape to the conductor layer. The protective layer may also include a wear-resisting layer of a prior art type between the conductive layer and the conductor layer, a portion of the conductive layer being preferably connected to the conductor layer. The conductive layer is preferably a mixed layer of SiC and ZrB.sub.2 containing ZrB.sub.
    Type: Grant
    Filed: February 7, 1996
    Date of Patent: December 8, 1998
    Assignee: Rohm Co., Ltd.
    Inventors: Hideaki Hoki, Toshihiko Takakura, Haruhiko Yamashita, Kunio Motoyama, Mitsuhiko Fukuda, Yasuzo Matsuo
  • Patent number: 5680170
    Abstract: A thermal printhead according to the present invention includes an insulating head substrate (8) having an obverse surface (8a), a reverse surface (8b), a first longitudinal edge surface (8c) and a second longitudinal edge surface (8d). The surface (8a) of the head substrate (8) is formed with an array of heating dots (10a) along the first longitudinal edge surface (8c), a common electrode pattern (11) electrically connected to the array of heating dots (10a) adjacent to the first longitudinal edge surface (8c) and individual electrodes (12) extending away from the common electrode pattern (11) and being electrically connected to the respective heating dots (10a). The heating dots (10a) are selectively heated by drive elements. The common electrode pattern (11) is electrically connected to an auxiliary electrode layer (14) which covers at least the first longitudinal edge surface (8c), reverse surface (8b) and second longitudinal edge surface (8d) of the heat substrate (8).
    Type: Grant
    Filed: January 16, 1996
    Date of Patent: October 21, 1997
    Assignee: Rohm Co. Ltd.
    Inventors: Hideo Taniguchi, Toshihiko Takakura, Hideaki Hoki, Masatoshi Nakanishi