Patents by Inventor Hideaki Hyodo

Hideaki Hyodo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7200881
    Abstract: A transfer device includes a lower mechanism and an upper mechanism stacked on the lower mechanism. The lower mechanism includes a first endless belt, and the upper mechanism includes a second endless belt. The first and the second endless belts are operable independently of each other for forward and backward circulation. The first endless belt is driven by a first driving unit disposed at one end of the lower mechanism as viewed in the traveling direction of the first endless belt. The second endless belt is driven by a second driving unit disposed at one end of the upper mechanism as viewed in the traveling direction of the second endless belt. A plurality of transfer devices connected in their widthwise direction constitute a transfer device assembly.
    Type: Grant
    Filed: September 29, 2004
    Date of Patent: April 10, 2007
    Assignee: Daihen Corporation
    Inventors: Fumio Kasagami, Fumio Hojo, Hideaki Hyodo
  • Publication number: 20050066442
    Abstract: A transfer device includes a lower mechanism and an upper mechanism stacked on the lower mechanism. The lower mechanism includes a first endless belt, and the upper mechanism includes a second endless belt. The first and the second endless belts are operable independently of each other for forward and backward circulation. The first endless belt is driven by a first driving unit disposed at one end of the lower mechanism as viewed in the traveling direction of the first endless belt. The second endless belt is driven by a second driving unit disposed at one end of the upper mechanism as viewed in the traveling direction of the second endless belt. A plurality of transfer devices connected in their widthwise direction constitute a transfer device assembly.
    Type: Application
    Filed: September 29, 2004
    Publication date: March 31, 2005
    Applicant: DAIHEN CORPORATION
    Inventors: Fumio Kasagami, Fumio Hojo, Hideaki Hyodo