Patents by Inventor Hideaki Hyuga
Hideaki Hyuga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10161617Abstract: A lighting apparatus includes: a projection lens; a light source behind the projection lens; a reflector that reflects light from the light source toward the projection lens; and a shield that blocks a portion of the light reflected by the reflector to form a cutoff line in a distribution pattern of the light. A textured section demarcated by unit regions is formed on a surface of the projection lens, and when a region in a center of the projection lens is defined as a central region, and regions left and right of the central region are defined as left and right regions, respectively, in a front view, a proportion of the unit regions in the central region is greater than a proportion of the unit regions in each of the left region and the right region.Type: GrantFiled: December 27, 2016Date of Patent: December 25, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yoshihiko Kanayama, Naoki Tomoda, Hideaki Hyuga
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Publication number: 20170184268Abstract: A lighting apparatus includes: a projection lens; a light source behind the projection lens; a reflector that reflects light from the light source toward the projection lens; and a shield that blocks a portion of the light reflected by the reflector to form a cutoff line in a distribution pattern of the light. A textured section demarcated by unit regions is formed on a surface of the projection lens, and when a region in a center of the projection lens is defined as a central region, and regions left and right of the central region are defined as left and right regions, respectively, in a front view, a proportion of the unit regions in the central region is greater than a proportion of the unit regions in each of the left region and the right region.Type: ApplicationFiled: December 27, 2016Publication date: June 29, 2017Inventors: Yoshihiko KANAYAMA, Naoki TOMODA, Hideaki HYUGA
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Patent number: 9685594Abstract: An LED module includes a submount having a face in a thickness direction thereof, an LED chip bonded to the face of the submount with a first bond, and a patterned wiring circuit electrically connected to the LED chip. The first bond transmits light emitted from the LED chip. The submount is a light-transmissive member having light diffusing properties, and a planar size larger than a planar size of the LED chip. The patterned wiring circuit is provided on the face of the submount so as not to overlap the LED chip. The submount is constituted by a plurality of light-transmissive layers which are stacked in the thickness direction and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip.Type: GrantFiled: May 24, 2013Date of Patent: June 20, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yoji Urano, Kenichiro Tanaka, Akifumi Nakamura, Toru Hirano, Hideaki Hyuga, Masanori Suzuki, Teruhisa Yokota
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Patent number: 9680075Abstract: A light-emitting device in accordance with the present invention includes a mounting substrate; an LED chip bonded to a surface of the mounting substrate with a bond; and an encapsulating portion covering the LED chip. The bond transmits light from the LED chip. The mounting substrate includes: a light-transmissive member having a planar size larger than that of the LED chip; and first and second penetrating wirings which penetrate the light-transmissive member in the thickness direction thereof and are electrically connected to first and second electrodes of the LED chip via first and second wires, respectively. The light-transmissive member includes at least two light-transmissive layers with different optical properties which are stacked in the thickness direction. A light-transmissive layer of the light-transmissive layers which is farther from the LED chip is higher in reflectance to the light.Type: GrantFiled: August 30, 2013Date of Patent: June 13, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yoji Urano, Akifumi Nakamura, Hayato Ioka, Toru Hirano, Masanori Suzuki, Hideaki Hyuga, Ryoji Imai, Jun Goda
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Patent number: 9437581Abstract: The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.Type: GrantFiled: May 24, 2013Date of Patent: September 6, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yoji Urano, Akifumi Nakamura, Hayato Ioka, Ryoji Imai, Jun Goda, Toru Hirano, Masanori Suzuki, Hideaki Hyuga
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Publication number: 20150137149Abstract: An LED module includes a submount having a face in a thickness direction thereof, an LED chip bonded to the face of the submount with a first bond, and a patterned wiring circuit electrically connected to the LED chip. The first bond transmits light emitted from the LED chip. The submount is a light-transmissive member having light diffusing properties, and a planar size larger than a planar size of the LED chip. The patterned wiring circuit is provided on the face of the submount so as not to overlap the LED chip. The submount is constituted by a plurality of light-transmissive layers which are stacked in the thickness direction and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip.Type: ApplicationFiled: May 24, 2013Publication date: May 21, 2015Applicant: PANASONIC CORPORATIONInventors: Yoji Urano, Kenichiro Tanaka, Akifumi Nakamura, Toru Hirano, Hideaki Hyuga, Masanori Suzuki, Teruhisa Yokota
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Publication number: 20150108510Abstract: The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.Type: ApplicationFiled: May 24, 2013Publication date: April 23, 2015Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yoji Urano, Akifumi Nakamura, Hayato Ioka, Ryoji Imai, Jun Goda, Toru Hirano, Masanori Suzuki, Hideaki Hyuga
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Publication number: 20150077982Abstract: An LED module includes: an opaque substrate on which a wiring circuit is provided; a submount bonded to a surface of the opaque substrate with a first bond; an LED chip bonded with a second bond to an opposite side of the submount from the opaque substrate; and wires electrically connecting the LED chip to patterned wiring circuit. In the LED module, the first bond and the second bond each allow light emitted from the LED chip to pass therethrough. The submount is a light-transmissive member. A lighting device includes a device main body and the LED module. The lamp includes the LED module.Type: ApplicationFiled: May 24, 2013Publication date: March 19, 2015Applicant: PANASONIC CORPORATIONInventors: Yoji Urano, Kenichiro Tanaka, Akifumi Nakamura, Toru Hirano, Hideaki Hyuga, Masanori Suzuki, Teruhisa Yokota
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Publication number: 20150048402Abstract: A light-emitting device in accordance with the present invention includes a mounting substrate; an LED chip bonded to a surface of the mounting substrate with a bond; and an encapsulating portion covering the LED chip. The bond transmits light from the LED chip. The mounting substrate includes: a light-transmissive member having a planar size larger than that of the LED chip; and first and second penetrating wirings which penetrate the light-transmissive member in the thickness direction thereof and are electrically connected to first and second electrodes of the LED chip via first and second wires, respectively. The light-transmissive member includes at least two light-transmissive layers with different optical properties which are stacked in the thickness direction. A light-transmissive layer of the light-transmissive layers which is farther from the LED chip is higher in reflectance to the light.Type: ApplicationFiled: August 30, 2013Publication date: February 19, 2015Applicant: PANASONIC CORPORATIONInventors: Yoji Urano, Akifumi Nakamura, Hayato Ioka, Toru Hirano, Masanori Suzuki, Hideaki Hyuga, Ryoji Imai, Jun Goda