Abstract: The present invention aims to provide a stack having high electrical connection reliability, a curable resin composition used for the stack, a method for producing the stack, a method for producing a substrate having a bonding electrode used for producing the stack, a semiconductor device including the stack, and an imaging device including the stack. Provided is a stack sequentially including: a first substrate having an electrode; an organic film; and a second substrate having an electrode, the electrode of the first substrate and the electrode of the second substrate are electrically connected via a through-hole extending through the organic film.

Abstract: Provided is a curable composition for an electronic component that can be quickly cured and furthermore can have increased storage stability. The curable composition for an electronic component according to the present invention contains an epoxy compound, an anionic curing agent, a flux, and a basic compound excluding the anionic curing agent.

Abstract: There is provided a conductive material which has a rapid reaction rate and is high in fluxing effect. The conductive material according to the present invention includes a conductive particle having solder at at least an external surface, an anionically hardenable compound, an anionic hardener, and an organic acid having a carboxyl group and having a functional group that is an esterified carboxyl group.

Abstract: Provided are a conductive particle and a conductive material which are capable of decreasing the connection resistance and suppressing generation of voids in a connection structure when the connection structure is obtained by electrically connecting electrodes. The conductive particle according to the present invention has a solder at a conductive surface, wherein a group including a carboxyl group is covalently bonded to the surface of the solder; and the conductive material according to the present invention includes the conductive particles and a binder resin.

Abstract: There is provided a conductive material which has a rapid reaction rate and is high in fluxing effect. The conductive material according to the present invention includes a conductive particle having solder at at least an external surface, an anionically hardenable compound, an anionic hardener, and an organic acid having a carboxyl group and having a functional group that is an esterified carboxyl group.

Abstract: Provided is a curable composition for an electronic component that can be quickly cured and furthermore can have increased storage stability. The curable composition for an electronic component according to the present invention contains an epoxy compound, an anionic curing agent, a flux, and a basic compound excluding the anionic curing agent.

Abstract: Provided are a conductive particle and a conductive material which are capable of decreasing the connection resistance and suppressing generation of voids in a connection structure when the connection structure is obtained by electrically connecting electrodes. The conductive particle according to the present invention has a solder at a conductive surface, wherein a group including a carboxyl group is covalently bonded to the surface of the solder; and the conductive material according to the present invention includes the conductive particles and a binder resin.

Abstract: It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

Abstract: The conductive material according to the present invention includes a binder resin and conductive particles each having a solder at a conductive surface, the binder resin includes a curable compound capable of being cured by heating, and a thermal curing agent, and when the binder resin and the solder in the conductive particle are each heated at a temperature rising rate of 10° C./minute to perform differential scanning calorimetry, an exothermic peak top temperature in curing of the binder resin is lower than an endothermic peak top temperature in melting of the solder.

Abstract: The present invention provides a conductive material capable of decreasing the connection resistance of a connection structure when the connection structure is obtained by electrically connecting electrodes. The conductive material according to the present invention includes a binder resin and conductive particles each having a solder at a conductive surface, the binder resin includes a curable compound capable of being cured by heating, and a thermal curing agent, and when the binder resin and the solder in the conductive particle are each heated at a temperature rising rate of 10° C./minute to perform differential scanning calorimetry, an exothermic peak top temperature in curing of the binder resin is lower than an endothermic peak top temperature in melting of the solder.

Abstract: A method for producing a semiconductor chip laminate, which comprises applying an adhesive to a substrate or other semiconductor chip; laminating the semiconductor chip on the substrate or other semiconductor chip via the adhesive; uniformly wetting and spreading the adhesive on an entire region for bonding the semiconductor chip on the substrate or other semiconductor chip; and curing the adhesive. In the application step, an area for applying adhesive is 40% to 90% of the region for bonding the semiconductor chip located on the substrate or other semiconductor chip, immediately after laminating, an area with the adhesive thereon is 60% to less than 100% of the region for bonding the semiconductor chip on the substrate or other semiconductor chip, and in wetting and spreading the adhesive, a viscosity of adhesive between the substrate or other semiconductor chips and the semiconductor chip at 0.5 rpm is 1 Pas to 30 Pas.

Abstract: The present invention provides an anisotropic conductive material that facilitates connection between electrodes to enhance the conduction reliability when used for connecting the electrodes, and a connection structure produced from the anisotropic conductive material. The present invention is an anisotropic conductive material comprising: conductive particles (1) each including a resin particle (2) and a conductive layer (3) coating the surface (2a) of the resin particle (2); and a binder resin; wherein at least an exterior surface layer of the conductive layer is a solder layer (5). The present invention is a connection structure comprising: a first connection target member; a second connection target member; and a connection part connecting the first connection target member and the second connection target member, wherein the connection part is formed of the anisotropic conductive material.

Abstract: A process for producing a film pattern, in which a layer of photosensitive resin composition is formed on a substrate and exposed selectively through a mask to light to thereby obtain a film pattern provided on its surface with protrusions and depressions without the need to remove the layer of photosensitive resin composition at unexposed regions or exposed regions by, for example, development; and a photosensitive resin composition for use in the above process for producing a film pattern.

Abstract: It is an object of the present invention to provide a method for producing a semiconductor chip laminate, which adjusts the amount of an adhesive for semiconductor components extending from a bonded region of a semiconductor chip and provides a smaller but highly-precise and highly-reliable semiconductor chip laminate.

Abstract: It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

Abstract: It is an object of the present invention to provide: an adhesive for electronic parts that makes it possible to accurately maintain a distance between electronic parts upon joining electronic parts such as two or more semiconductor chips and also to obtain reliable electronic parts such as a semiconductor device; a method for producing a semiconductor chip laminated body using the adhesive for electronic parts; and a semiconductor device using the adhesive for electronic parts. The present invention is an adhesive for electronic parts configured to join the electronic parts, which contains: an adhesive composition comprising a curing compound and a curing agent; and spacer particles having a CV value of 10% or less, a viscosity at 1 rpm being 200 Pa·s or less and a viscosity at 10 rpm being 100 Pa·s or less, upon being measured at 25° C. by using an E type viscometer, and a viscosity at 0.5 rpm being 1.

Abstract: The present invention has its object to provide an adhesive for electronic components, excellent in coatability, having high preventability of stains in bonded electronic components, and capable of providing highly reliable electronic components. The present invention relates to a liquid adhesive for electronic components, containing: a curable compound; a curing agent; and inorganic fine particles, a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 8 to 11 (including 8 and not including 11), the inorganic fine particles including a mixture of at least inorganic fine particles (A) and inorganic fine particles (B), the inorganic fine particles (A) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) in the range of 30 to 50 (including 30 and 50), and the inorganic fine particles (B) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 60 or more.

Abstract: The present invention has its object to provide an adhesive for electronic components, excellent in coatability, having high preventability of stains in bonded electronic components, and capable of providing highly reliable electronic components. The present invention relates to a liquid adhesive for electronic components, containing: a curable compound; a curing agent; and inorganic fine particles, a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 8 to 11 (including 8 and not including 11), the inorganic fine particles including a mixture of at least inorganic fine particles (A) and inorganic fine particles (B), the inorganic fine particles (A) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) in the range of 30 to 50 (including 30 and 50), and the inorganic fine particles (B) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 60 or more.

Abstract: The present invention has its object to provide an adhesive for bonding electronic components with a constant distance between them, which makes it possible to maintain a distance between bonded electronic components at high accuracy and to provide a highly reliable electronic apparatus, and which can be stably and continuously applied with a jet dispenser. The present invention is an adhesive for bonding electronic components, including spacer particles, an epoxy compound (A), and a curing agent. The spacer particles have a CV value of 10% or less. The epoxy compound (A) has a molecular structure including 10 or less monomer units with an aromatic ring in each repeating unit, is in a state of crystalline solid at 25° C., and has a viscosity of 1 Pa·s or less measured by an E-type viscometer at a temperature of 50 to 80° C.

Abstract: It is an object of the present invention to provide: an adhesive for electronic parts that makes it possible to accurately maintain a distance between electronic parts upon joining electronic parts such as two or more semiconductor chips and also to obtain reliable electronic parts such as a semiconductor device; a method for producing a semiconductor chip laminated body using the adhesive for electronic parts; and a semiconductor device using the adhesive for electronic parts. The present invention is an adhesive for electronic parts configured to join the electronic parts, which contains: an adhesive composition comprising a curing compound and a curing agent; and spacer particles having a CV value of 10% or less, a viscosity at 1 rpm being 200 Pa·s or less and a viscosity at 10 rpm being 100 Pa·s or less, upon being measured at 25° C. by using an E type viscometer, and a viscosity at 0.5 rpm being 1.